PI materials

PI plastic - Polyimide

PI material is a non-melting high temperature polymer. PI polymers are characterised by an unusually complex property profile with many outstanding individual properties and are at the top of the materials pyramid. They are always used when conventional thermoplastics, ceramics or metals fail. This is because excellent temperature resistance, high mechanical strength and dimensional stability remain high even in continuous use and under mechanical stress.

With excellent friction and wear properties, even when unlubricated and under high pV loads, polyimide material is also ideal for demanding tribological applications. PI Polyimide applications can be found in many industries. High purity and low outgassing behaviour are additional advantages for applications in the aerospace, vacuum and semiconductor industries.

Polyimides are manufactured by polycondensation. Due to the high proportion of ring-shaped, mostly aromatic chain links and high molecular weights, polyimides are always infusible. They are therefore processed exclusively by sintering techniques.

Manufacturers of polyimide products and finished parts

As a polyimide manufacturer and supplier, Ensinger offers a wide range of polyimide solutions. This includes PI semi-finished products such as polyimide sheets, rods and tubes as well as polyimide powder. In addition, directly formed polyimide finished parts can be produced cost-effectively using the direct forming process in quantities of 1000 parts or more. Polyimide machining according to your drawings is also possible.

Polyimide plates and Rods - Manufacturer of Polyimide Stock shapes

Polyimide shape materials

Polyimides are often known under the brand name Vespel, but at Ensinger they are known under the trade name TECASINT. 

Ensinger supplies sintered polyimides as semi-finished products in the following forms in many different dimensions.

  • Polyimide sheet / plate
  • Polyimide rod
  • Polyimide tube

Vespel® is a trademark of DuPont de Nemours, Inc.

Due to the different chemical structures of the PI Polymers, the individual materials can each be assigned to a TECASINT product family. Each family offers different properties and benefits for different applications and industries:


  • Very high modulus
  • High stiffness and hardness
  • Previous designation "SINTIMID"


  • Very high modulus
  • High stiffness
  • High hardness
  • Significantly reduced moisture absorption compared to TECASINT 1000
  • Higher toughness and better machinability compared to TECASINT 1000


  • HDT /A up to 470 °C
  • Highest oxidation stability 
  • Lowest water absorption
  • Low friction and wear values
  • Best chemical resistance
  • Different types with high elongation at break and toughness or with high flexural modulus available


  • Cost-effective polyimide grade for the semiconductor industry
  • Very good dimensional stability
  • Load capacity up to 300 °C

TECASINT 6000 (Grade for Direct Forming)

  • Very good long-term thermal and oxidative stability
  • High modulus and strength over a wide temperature range
  • Very good sliding & friction properties in lubricated and non-lubricated environments
  • Excellent wear properties
  • High creep resistance
  • Low water absorption
  • Low outgassing in vacuum
  • Improved chemical resistance compared to conventional polyimides 


  • Matrix of PTFE reinforced with PI powder
  • Reduced creep under load
  • Ideally suited for soft mating surfaces (stainless steel, aluminium, brass, bronze)
  • Excellent sliding and friction properties 
  • Highest chemical resistance
  • Easy machining properties

Depending on the application, we offer the following modifications:

Natural types, unfilled

Thermal and electrical insulating, best mechanical properties:  

For sliding and friction applications

For sliding and friction application in vacuum or under technically dry conditions

  • Types with MoS2
  • Types for semi-finished products: TECASINT 2391

For semiconductor and electronic applications

For high dimensional stability and low thermal expansion 

All common materials, modifications and dimensions are available from stock. In addition, we manufacture special dimensions on customer request.

Polyimide PROPERTIEs

Polyimide can be used in a wide temperature range from -270 °C to 350 °C. It retains its strength and dimensional stability and creep resistance even at high temperatures above 260 °C and achieves impressive heat resistance values of up to 470 °C (HDT/A). 
Storage E modulus
High purity and low outgassing values characterise polyimides in vacuum, aerospace and semiconductor applications. In addition, special grades with specified ESD properties (surface resistivity) are available for the electronics and semiconductor industries.
Low outgassing table
Thanks to its excellent friction and wear properties combined with high pV loads, PI material is ideal for demanding tribological applications. In practice, this often results in an increase in service life and a reduction in maintenance and operating costs. In addition to use in lubricated applications, Ensinger's PI plastics also offer the ideal solution for dry-running or vacuum applications.
Block on ring

Further polyimide material properties are:

  • Long-term thermal stability 300 °C (short term up to 400 °C)
  • High heat resistance up to 470 °C (HDT/A)
  • Good cryogenic properties down to -270 °C
  • High strength, modulus and stiffness even at temperatures above 260 °C
  • Excellent wear resistance even under high pressure and high speeds
  • Excellent thermal and electrical insulation
  • Low thermal conductivity
  • High purity, low outgassing in vacuum according to ESA regulation ECSS-Q-70-02
  • Good machinability
  • Good chemical resistance to acids, greases and solvents
  • Inherently flame retardant
  • Resistant to high-energy radiation

Polyimide APPLICATIONS examples

  • Bearing elements, bushings, bearing cages, piston rings and guide elements for tribological applications and mechanical engineering
  • Thermal and electrical insulation components in mechanical engineering and the electrical engineering and semicon industries
  • Hot glass handling parts in the glass industry
  • Seals and valve seats
  • Aerospace applications
  • Production equipment for semiconductor manufacturing
  • IC test sockets
  • Radiation and chemical resistant valve seals
  • Vacuum technology
  • Cryogenic components down to -270 °C

Sensor housing

  • Thermal resistance up to 300 °C
  • Very good electrical insulation

Machined TECASINT 5111 natural

Bottle gripper / Take-out inserts

made from TECASINT 6032 natural

  • Cost savings due to 3-4 times greater durability compared to conventional materials (graphite)
  • Excellent war resistance
  • Significant reduction of micro cracks
  • Low thermal conductivity, good impact resistance and high modulus of elasticity 

Test socket made of TECASINT 4011 (PI)

  • Low outgassing 
  • No condensable impurities
  • High dimensional stability
  • Thermal resistance up to 300 °C
  • High strength
  • Good electrical insulation