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Sebastian & Michael Ensinger Microsystems

Microsystems and MEMS technology

A new approach to functionalisation and customisation

Many products and systems in the fields of mobility, medicine, electrical engineering and energy would be inconceivable without microsystems or microelectromechanical systems (MEMS). The current framework conditions place high demands on the manufacturers of microsystems: complex and cost-intensive production processes, complex machinery and labour-intensive back-end processes limit the possibilities. Progress in the microsystems sector is also slowed by issues such as scarcity of raw materials and technological limitations.

Ensinger Microsystems offers a completely new approach. We are the first manufacturer in the world to combine MEMS technology with the advantageous properties of high-performance plastics. This offers a completely new way of producing microsystems on plastic wafers. With our newly developed process, we produce functionalised microsystems with previously unimaginable possibilities for customisation: faster, more cost-effective and with the flexibility to adapt to your requirements.

Our new process chain - from compound to finished device - can be covered in-house or via partners firmly anchored in the value chain. It eliminates complex and costly process steps. This enables us to produce conventional MEMS applications such as sensors or transformers faster and at lower cost. We can also create completely new possibilities tailored to your application. We bring together many years of experience and innovative development processes under a single roof - for materials, products and services of the highest quality.

Microsystems tailored to your needs:  Your benefits at a glance

Ensinger Microsystems' new approach makes it possible to manufacture complete microsystems outside the cleanroom environment and with a significant reduction in back-end processes. As a result, MEMS applications can be manufactured with less financial and technological effort and with comparable precision to conventionally manufactured microsystems. The starting point is a wafer substrate made of laser-activated PEEK (PEEK LDS), onto which very fine conductor track structures can be applied.  This replaces or even eliminates process steps that previously had to be carried out in a clean room environment. The number of steps required to get to the finished system is also significantly reduced.


The functionalisation of the substrate compared to classic LDS technology should be emphasised. EMS technology can be used to apply functional layers that can be used, for example, to measure physical parameters. Thin layers of platinum, nickel-iron or nickel-chromium are suitable for this sensor functionalisation.


Another special feature is the customisability of the substrate. In contrast to conventional substrates, customer-specific requirements for the design of the microsystem or the substrate can be implemented specifically according to the customer's wishes. Ideally, the microsystem or substrate can be designed to suit the installation situation, allowing the highest possible level of integration, which ideally also avoids the need for additional housings and other components.

Reliable supply chain and production 

By shortening the process chain compared to traditional microsystems, Ensinger Microsystems technology guarantees a short supply chain and a fast, customised production solution. Reliability of supply is guaranteed through the use of our own compound.

microsystems One-Stop Shop: from compound to finished component

More than 50 years of experience has given us a deep understanding of high-performance plastics and manufacturing processes. We also understand the need to constantly adapt to changing market trends, customer requirements and the challenges of modern applications. Rethinking existing processes, developing them further and driving new approaches has always been an integral part of what we do.

Benefit from:

  • Over 50 years of experience in the development, application and processing of high performance thermoplastics
  • Proprietary compounds such as TECACOMP LDS
  • Highly skilled experts in process technologies, such as injection molding, relevant to the production of innovative Ensinger Microsystems
  • In-house production of microsystems, sensors, transformers, wafers and other components
  • Coating processes and laser structuring from established partners as an integral part of the production chain

Depending on your requirements, we can offer you the complete supply chain from compound to finished component.

Ensinger Microsystems MEMS Products and Services


Learn more about how the use of TECAWAFER® can make your MEMS applications:

  • More secure
  • Customisable
  • Sustainable
  • And saves time, costs and resources


Find out more about the new sensor technology from Ensinger Microsystems:

  • Using thin film functionalisation
  • Integrable and adaptable to the installation situation
  • Shortened process chain and higher delivery reliability


Find out now and benefit from the advantages of transformers Ensinger Microsystems offers:

  • Volume savings of up to 80 %
  • Significantly reduced consumption of resources such as copper
  • Significant weight reduction

Microsystems Industries