MEMS applications at Ensinger Microsystems 

Functionalised sensors - fully integratable

With Ensinger Microsystems, we offer a completely new type of sensor. We are opening up a new state of the art. Based on wafers of high performance plastics, we produce sensors that can be functionalised and replace existing components with a cheaper, simpler and fully integrable solution. With over 50 years of experience in high performance plastics, we base this innovative new manufacturing method on in-depth expertise, local production processes and established supply chains.  Our microsystems experts support your project at every stage of the value chain. This ensures the highest quality from compound to finished part.

innovative new sensor technology with ensinger microsystems

Wafers made of laser direct structurable high performance plastic

There is little scope for customisation with wafers made from conventional raw materials such as silicon wafers, glass wafers, sapphire wafers or silicon carbide wafers. Our polymer-based wafers offer a whole new range of possibilities that can be implemented in a cost-effective manner, even in small quantities.

Functionalisation and integration through thin film structures

Compared to classic LDS technology, the functionalisation of the substrate is particularly important. EMS technology can be used to apply functional layers. These can be used, for example, to measure physical parameters. For this sensor functionalisation, thin layers of platinum, nickel-iron or nickel-chromium are suitable.

Completely new approaches to sensor size, geometry and placement

A further special feature is the ability to customise the substrate. Unlike conventional substrates, customer-specific requirements for the design of the microsystem or substrate can be implemented according to the customer's wishes. With this, the microsystem or substrate can also be designed to suit the installation situation. This allows the highest possible level of integration.

Production of sensor systems: Easier, faster, customised - all from a single source

By combining the advantageous properties of the high performance plastic TECACOMP PEEK LDS with microsystems technology processes, functionalised, integrated and fully customisable sensors are created. With Ensinger Microsystems' new approach, we can manufacture existing components more easily and efficiently, or create completely new, integrated solutions.

Exploiting the benefits of TECACOMP PEEK LDS in TECAWAFER®

The substrates pre-structured with this process consist of a laser direct structurable (LDS) high temperature thermoplastic, TECACOMP PEEK LDS. Due to its high chemical resistance and thermal stability, the high performance plastic PEEK is ideally suited as a wafer.

  • Higher raw material availability than conventional materials
  • Significantly simplified manufacturing process, resulting in a much shorter process chain
  • Customisable formability of the material and associated design freedom
  • Optimum performance at reduced material and manufacturing costs
  • Reduction of back-end processes and simplification of complicated contacts
  • Recyclability of the material
TECAWAFER®

MEMS sensors with Ensinger Microsystems - the new technology

Conventional process chain on silicon

Conventional sensor systems are currently still structured using lithography processes. Due to the photo-resist-based structuring processes, the established production processes for sensor manufacturing must necessarily take place in a cleanroom environment.
This makes high investments in infrastructure and plant operation necessary.

New process chain on TECAWAFER®

Our manufacturing process, developed at Ensinger Microsystems, uses plastic injection molding to produce substrates that can be manufactured in high volumes on a microstructured mold insert. Instead of structuring individual silicon, glass, sapphire wafers or foil substrates, the number of individual process steps can be significantly reduced.

Sensor Application Examples

  • Pressure Sensors
  • Strain Gauges, Pressure or Temperature Sensors
  • CO2 Sensors
  • Vibration Sensors
  • Current Sensors
  • Magnetic Field Sensors
  • Magnetoresistive Sensors