TECACOMP PEEK LDS black 1047045
Laser direct structurable PEEK compound
TECACOMP PEEK LDS black is a high-performance, laser-direct-structurable PEEK compound that combines thermal resistance, dimensional stability, and electrical functionality for the production of electronically functionalised plastic components. Developed for PEEK plastic injection moulding, this specialised PEEK polymer enables the creation of structured conductor tracks directly on the component surface using the LDS (laser direct structuring) process.
Based on modified PEEK resin, the material is engineered for maximum thermomechanical stress. It allows the reliable production of adhesive, fine conductor track structures and VIAs with small aspect ratios – ideal for miniaturised, surface-mounted electronic components. With an adapted coefficient of thermal expansion (CTE) close to copper and improved thermal conductivity, the PEEK compound reduces thermal stresses in metallised areas.
It is particularly suited for structured housings or carrier elements where high precision, reflow compatibility, and weld line strength are required. Compared to LCP-based LDS plastics, it offers significantly higher stability in complex geometries with drill holes, breakthroughs, or transition areas.
The material demonstrates excellent electrical stability and low dielectric loss even at >20 GHz, making it ideal for high-frequency applications such as 5G antennas, mmWave components, radar, and lidar sensors. With a continuous service temperature of up to 260 °C, UL94 V-0 flame resistance, very low water absorption, and minimal outgassing, it also fulfills requirements in aerospace, semiconductor, medical, and industrial electronics.
Thanks to this unique property profile, TECACOMP PEEK LDS black complements Ensinger’s portfolio of advanced PEEK plates and PEEK sheets, offering a robust solution for RF systems, hybrid electronics, and safety-critical components.
Based on modified PEEK resin, the material is engineered for maximum thermomechanical stress. It allows the reliable production of adhesive, fine conductor track structures and VIAs with small aspect ratios – ideal for miniaturised, surface-mounted electronic components. With an adapted coefficient of thermal expansion (CTE) close to copper and improved thermal conductivity, the PEEK compound reduces thermal stresses in metallised areas.
It is particularly suited for structured housings or carrier elements where high precision, reflow compatibility, and weld line strength are required. Compared to LCP-based LDS plastics, it offers significantly higher stability in complex geometries with drill holes, breakthroughs, or transition areas.
The material demonstrates excellent electrical stability and low dielectric loss even at >20 GHz, making it ideal for high-frequency applications such as 5G antennas, mmWave components, radar, and lidar sensors. With a continuous service temperature of up to 260 °C, UL94 V-0 flame resistance, very low water absorption, and minimal outgassing, it also fulfills requirements in aerospace, semiconductor, medical, and industrial electronics.
Thanks to this unique property profile, TECACOMP PEEK LDS black complements Ensinger’s portfolio of advanced PEEK plates and PEEK sheets, offering a robust solution for RF systems, hybrid electronics, and safety-critical components.