LCP Compounds

TECACOMP LCP - LCP granules from Ensinger

Ensinger produces LCP granules under the brand name TECACOMP LCP and develops them especially for applications in the electronics industry.

The LCP compounds are highly filled. The fillers and additives used enable the application of conductive structures are known as Laser Direct Structuring (LDS). They can be used to produce 3-dimensional components with electrical functions in injection molding and are particularly suitable for thin-walled applications. All LCP compounds from Ensinger can also be adapted to special customer requirements.