P84 solution grades for coatings

TECAPOWDER P84 solution grade granulate is used to make special coatings and adhesives. Films, coatings or stand-alone substrates made from P84 are very useful in applications that require elevated temperatures along with excellent chemical resistance. P84, based on P84^® by Evonik, is a fully imidized polyimide in solution form. It does not require a long post cure step – simply the removal of the solvent.

P84 solutions have many advantages for coatings

TECAPOWDER P84 solution grade granulate has important uses in the industry due to the unique combination of high temperature stability and chemical resistance.

Specialty coatings made of TECAPOWDER P84 granulate allow customers to formulate different weight percent solids content and allow for various additives to improve end use characteristics. The fully imidized solutions can be used as structural adhesives and bond very well to most metals.

Outstanding properties

Chemical properties

Solution grade granulate

Solid P84 polyimide for dissolving in NMP, DMSO, Dmac. Solutions in NMP are achievable from 5-35 % solid content in NMP.

Fully imidized
Excellent chemical resistance to acids reaching to the neutral side of the pH scale
Excellent resistance to organic solvents, oils and fuels e.g.: nitric acid, hydrochloric acid, acetic acid, formic acid, oxalic acid, ethylene glycol, acetone, benzene, diglycolic methyl ether, methylene glycol, perchloro ethylene, tetra chloro ethane, toluene and trichloroethylene
Contact with alkaline media should be avoided
Solubility in high polar solvents such as dimenthylformamide (DMF), N-Methylpyrrolidone (NMP)

Viscosity

Viscosity versus solid content in NMP

(Typical Solution Grade Granulate)

Thermal properties

TECAPOWDER P84 is an organic polymer with exceptional heat resistance.

Glass transition temperature (Tg)	315 °C (599 °F)
Decomposition temperature (onset)	> 550 °C (> 1,000 °F)
10 % loss of weight	in air: 525 °C (977 °F)
	in nitrogen: 570 °C (1,000 °F)
No melting point
Limiting Oxygen Index (LOI)	38% O₂

Thermogravimetric analysis

Electrical properties

Dielectric strength	DC 415 V/µ
	AC (50 Hz) 280 V/µ
Dielectric constant (50 Hz, absolutely dry)	3,5
Dissipation factor (1 kHz)	0.001
Volume resistivity	10¹⁷ Ω.cm

Processing Guidelines

Dissolving procedure
Put desired quantity of granulate into clean and dry flask or container. Add accurate volume of NMP. Close the container tightly and shake immediately and continuously to avoid agglomeration. Put immediately on a roll jack and dissolve at low speed for 72 hours at room temperature.

Recommended solvent: N-Meth pyrrolidone (NMP)

Limit of possible solid content: approximately 30 %

Important note: Do not use high speed mixers for acceleration of dissolving process. Also do not heat solution.
Processing
Application by casting, dipping, spin-coating, spraying (only low viscosity) or roller coating

Non-compatibility with non-solvents (precipitation of polymer). Since the solvents used are hygroscopic, coagulation can also be triggered off by moisture.

Solubility in high polar solvents such as dimethylformamide (DMF), N-methyl pyrrolidone (NMP), etc.

Do not use mixers with high shear rate to incorporate additives like fillers

Thermal drying without chemical reaction

Contact with alkaline media should be avoided

Drying cycle for DMF-solution, coating 0,025 mm (2 Mil), dry
Softening temperature
(depending on residual solvent)