Interposer substrates made from PEEK

Close the gap between precision, performance and price

Modern microelectronics demands ever more compact, powerful and efficient systems. A key role in this is played by the interposer, which acts as an adapter layer between the silicon chip and the printed circuit board (PCB). It bridges the finest chip structures with coarser conductor track pitches and ensures lossless signal routing between both levels.
The choice of interposer substrate determines signal quality, reliability and production costs.

However, with the growing demand for 2.5D packaging, 3D-IC interposers, chiplet interposers and high-frequency applications such as radar or 5G, conventional materials are increasingly reaching their limits:

  • Silicon interposers: highest resolution, but costly and lossy at high frequencies.
  • Ceramic interposers: cost-effective, but too coarse for some applications and with poor tolerances.
  • Glass interposers: good electrical properties, but brittle and difficult to process.

The industry is therefore searching for a material that combines precision, frequency stability and cost-efficiency. The solution: PEEK-based interposer substrates from Ensinger. This high-performance polymer combines the fine resolution of a silicon interposer with the flexibility and cost-efficiency of organic interposers, significantly extending the capabilities of conventional technologies.

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Material Solutions for Interposers in the Semiconductor Industry

The choice of the right material is decisive in determining how well, how quickly and how reliably an interposer performs its function. Whilst silicon, glass and organic polymers have established themselves as proven materials, PEEK – as a new class of high-performance polymer – opens up entirely new possibilities with regard to performance, process integration and sustainability.

Thanks to its outstanding electrical, mechanical and thermal properties, PEEK combines the advantages of existing materials while also setting new benchmarks in RF transparency, chemical stability and process compatibility – as a forward-looking substrate material for high-performance, economically manufacturable next-generation interposers.

Learn more about our PEEK-based substrates here:
Ensinger Substrate Solutions

Why PEEK Makes the Difference

Structure & Precision

Thanks to its excellent dimensional stability, PEEK enables precise structuring even with very fine features and large wafer formats. The high surface quality and planarity facilitate the integration of precise conductor tracks and through-connections (VIAs), allowing PEEK interposers to deliver high resolution and manufacturing quality – comparable to silicon, yet at significantly lower cost.

Electrical Performance

With a low dielectric constant, PEEK offers excellent signal transmission properties. High-frequency signals can be transmitted with low loss and minimal attenuation, even at frequencies above 25 GHz. This makes the material particularly well suited to modern high-speed applications, such as those found in 5G and RF communication technology.

High Resistance

PEEK is characterised by exceptionally high resistance to heat and chemicals. Even under elevated temperatures or in aggressive media, the material remains stable and reliable. This makes it ideally suited to demanding operating environments in which conventional interposers reach their limits. 

Mechanical Stability

With its high strength and dimensional stability, PEEK withstands thermal and mechanical loads particularly well. It is suitable for both thin-film and wafer processes and prevents the deformation that can occur with other organic materials. This stability ensures precise tolerances and a long service life in operation.

Process Integration

A further advantage lies in PEEK's high compatibility with existing packaging, PCB and manufacturing processes. The material can be integrated into existing production lines without major process modifications, simplifying implementation and reducing costs.

 Recyclability

Compared to conventional substrates such as silicon, PEEK offers clear environmental advantages: it is recyclable, long-lasting and energy-efficient to process. PEEK thus makes an important contribution to more sustainable and resource-efficient electronics production.

Supply Chain & Origin

The production of PEEK interposers in Germany ensures short supply chains, high delivery reliability and reduced dependence on international procurement markets. This strengthens security of supply and supports local value creation.

Application-Specific Advantages of PEEK Interposer Substrates

As a substrate material, PEEK opens up new possibilities in interposer technology and offers measurable advantages across numerous applications – from high-frequency and communication systems to packaging solutions in microelectronics.
The following examples illustrate how PEEK enables technological and economic advances over conventional materials through its combination of precision, stability and chemical resistance.
  • At high frequencies, silicon interposers cause attenuation and capacitive effects. PEEK enables low-loss signal routing and remains RF-stable even above 25 GHz. This makes it ideally suited to radar chips, antenna modules and high-frequency systems where signal integrity is critical.
  • Antenna-on-chip designs benefit from PEEK's low permittivity and minimal attenuation. The material allows for more compact and efficient antenna structures at lower manufacturing costs, providing an economical platform for modern communication systems.
  • In demanding environments, PEEK impresses with its resistance to oils, temperatures and chemicals. The material ensures stable electrical properties and a long service life – ideal for precision sensors, pressure modules and industrial measurement systems.
  • With high VIA density, precise structuring and thermal stability, PEEK offers a cost-efficient alternative to silicon interposers. It enables reliable interconnection of multiple dies on a single carrier and supports scalable, highly integrated packaging architectures.
  • Interposer boards connect the chip and PCB, handling the electrical re-routing between fine chip structures and coarser conductor tracks. PEEK enables high resolution and dimensional accuracy whilst offering low weight, providing a stable, process-reliable solution even under thermal loads.
  • A BGA interposer connects the chip module to the PCB via solder balls. PEEK substrates reliably compensate for thermal stresses, maintain their dimensional stability and thus extend the service life of the assembly – particularly during varying temperature cycles.
  • Passive interposers consist exclusively of conductor tracks and through-connections (VIAs). PEEK enables the realisation of highly precise structures that combine electrical, thermal and mechanical stability – a high-performance foundation for modern chiplet designs.
  • In processor or computing modules, the interposer connects multiple chiplets within a system-on-package. PEEK supports high data rates through low signal losses whilst offering a thermally stable, cost-efficient substrate solution for high-performance processor architectures.
  • Photonic interposers combine electronic and optical signal paths within a single component. Thanks to its low attenuation and high surface quality, PEEK enables reliable integration of electronics and photonics – an important foundation for future high-speed and communication systems.

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Any questions about our products? Get in touch.

Stefan Bur

Business Development Manager
Ensinger Microsystems Technology​​

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