Manufacturing Microsystems on PEEK LDS Wafers

More powerful, more intelligent, more complex and more independent - the market for microsystems or Micro Electro Mechanical Systems is constantly growing. Many innovations in products and industries, for example in the automotive, medical, communications or energy sectors, are highly dependant on Micro Electro Mechanical Systems (MEMS).

Where currently complex and costly manufacturing methods, elaborate machinery and time consuming back-end processes place high demands on microsystems manufacturers, we offer a completely new approach with Ensinger Microsystems.

With the production of complete microsystems on Ensinger's own high-performance plastic and specially developed injection moulding processes, we offer suitable solutions for your individual application. The entire microsystems value chain - from compound to finished component - can be covered in-house at Ensinger.


 We combine many years of experience and innovative development processes under one roof: for high-quality materials, products and services.

Microsystems made of high-performance thermoplastics: TECACOMP LDS

 

The right LDS-compatible compound is essential for the production of microsystems. Find out more about the LDS-TECACOMP PEEK developed by Ensinger.

Manufacturing processes revolutionised: injection moulding at Ensinger

 

Our injection moulding experts provide a wide range of potential structuring options. Learn more about plastic injection moulding for microsystems.

MEMS Technology & MEMS Devices

 

With our innovative approach, we produce microsystems such as sensors or transformers in a much more efficient, cost- and time-saving way.  Find out more about the MEMS technology and MEMS devices below.


Rethinking manufacturing processes

Microsystems such as coils, sensors or capacitors are usually made using lithography, PVD coatings and electrodeposition. Most microsystems require various lithography steps for structuring, some of which require a clean room environment as well as UV light shielding. Thus, they often entail, among other things, high investment costs in the infrastructure of the manufacturing plant as well as very high operating costs.

With Ensinger Microsystems' new approach, it is possible to produce complete microsystems outside the cleanroom environment and with a significant reduction in back-end processes. This makes it possible to manufacture microtechnological systems with lower financial costs as well as technological expenditure with similar precision as conventionally manufactured microsystems.

Advantages of Ensinger Microsystems:

  • Shortening of the process chain

  • Development without clean room environment

  • Significantly simplified assembly by using backside contacting with the LDS process known from MID technology (Mold Interconnect Device)

  • Avoidance of wire bonding

  • Lower vertical range of manufacture and significantly lower investment in machine technology


Manufacturing of sensors and transformers

Sensor system

Sensor Systems

made of TECACOMP PEEK LDS

Manufacturing of Sensor Systems

Easy, fast and cost-effective manufacturing and assembly of sensor systems - without the need for a cleanroom environment! With our innovative new approach we produce sensor systems on PEEK LDS Wafers. Our highly qualified experts accompany you at every point of the value-added process - from the compound to the finished sensor system.

LDS-MID Transformers

made of TECACOMP PEEK LDS

LDS-MID Transformers

Our LDS-MID transformers do not require winding technology and can be manufactured and assembled without a housing thanks to the industrialised process at Ensinger. This significantly simplifies the process chain and allows it to be automated - for consistently high quality in production and optimum results.

Innovative solutions from a single source: from compound to finished component

More than 50 years of experience not only shape our in-depth knowledge of high-performance plastics and manufacturing processes. We also understand the need to constantly adapt to changing market developments, customer requirements and the challenges of modern applications. Rethinking existing processes, developing them further and driving new approaches has therefore always been an integral part of what we do.

 

Benefit from:

  • Over 50 years of experience in the development, use and processing of high-performance thermoplastics
  • In-house developed compounds such as TECACOMP LDS
  • Highly qualified experts in process technologies, such as injection moulding relevant for the production of innovative Ensinger Microsystems
  • In-house manufacturing of microsystems, sensors, transformers, wafers and other components
  • Coating processes and laser structuring by partners established in the market as an integral part of the production chain
  • All process steps from one source & made in Germany

 

Depending on your requirements, we can offer you the complete supply chain from compound to finished component.


Industries & Applications

Semiconductor & Electronic Industry

Power supplies, power electronics or electromobility.

 

Automotive Industry

Magnetic field sensors, such as AMR or GMR sensors in ABS systems of motor vehicles.

Rotary encoders or length scales in lifts, machine tools etc.

Strain gauges, pressure or temperature sensors.

 

Optical Applications

Optical fibres or diffraction gratings on LDS-based components, e.g. in CO2 sensors.