Wafers made from conventional raw materials such as silicon wafers, glass wafers, sapphire wafers or silicon carbide wafers offer little scope for customised solutions. Our polymer-based wafers offer completely new possibilities that can be economically realised even in small quantities. Industry-specific solutions such as biocompatible wafers for medical applications are also available. We are happy to advise you individually.
The short supply chain for the production of our TECAWAFER® and the components made from it is completely covered locally in Germany and the EU. All process steps from compound to component are covered in-house by Ensinger and by partners integrated into the value chain. The recyclability of the materials used in the wafer also contributes to the sustainable use of resources and thus reduces the CO2 footprint.
Due to the beneficial properties of the high performance polymer, TECAWAFER® offers unique technological advantages such as electrical insulation, thermal conductivity, LDS capability or the possibility of backside contacting through VIAs.
Our new wafer technology makes it possible to significantly shorten the value chain from raw material production to the Blanco wafer to the finished component. This leads to an enormous shortening of the supply chain and thus to an increase in delivery reliability for our customers. With TECAWAFER®, we offer a standard portfolio of wafers available from stock with a short supply chain and local production in Germany.
With TECAWAFER we offer a 4" wafer (100 mm diameter) made of TECACOMP PEEK LDS as an alternative to conventional silicon, ceramic or glass wafers. TECAWAFER can be further processed by standard lithography, PVD or PECVD processes and structured by LDS processes. In addition, the use of the high performance polymer PEEK makes TECAWAFER electrically insulating, yet thermally conductive and highly resistant to chemicals and temperatures.
Unlike conventional wafers available on the market, TECAWAFER is also LDS compatible. This enables the simplest solutions in connection and interconnection technology (e.g. by applying LDS solder pads) or backside contacting through easy-to-implement VIAs (vertical interconnect access).
We can coat TECAWAFER with customised thin films using standard processes such as PVD. In addition, we can produce highly complex thin film layouts using our patented Ensinger Microsystem Technology (EMST). TECAWAFER is available in several variants, including biocompatible wafers.
We are also constantly learning about new applications where our customers want to use TECAWAFER. Please contact us for a customised solution for your application.
