Rethinking wafers with TECAWAFER

Wafer solutions for advanced microsystems technologies

Electronic developers in microsystems technology face many challenges with traditional silicon, ceramic or glass wafers, leading to unnecessary complications, delays and production losses. With TECAWAFER, our polymer-based wafer, Ensinger Microsystems Technology (EMST) offers a revolutionary solution that is transforming technological progress.

With TECAWAFER, we are taking microsystems technology to a new level, offering tailor-made solutions that overcome the limitations of traditional wafer substrates. TECAWAFER offers unparalleled design freedom, enhanced packaging flexibility and simplifies the entire value chain, reducing dependence on lengthy global supply chains. The 4-inch wafer, based on TECACOMP PEEK LDS, offers outstanding chemical and temperature resistance - for solutions of the highest quality.

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Wafer manufacturing revolution: functionalisation, integration & customisation

Traditional sensor manufacturing is a time-consuming and resource-intensive process that often limits customised solutions to high volume production. It also imposes significant design constraints on applications. TECAWAFER, our innovative PEEK-based wafer, provides a solution that overcomes these limitations and enables the creation of functionalised, integrated, and customised solutions.

Wafer functionalisation

EMST’s TECAWAFER adds functionality to components. Our PEEK-based wafer enables customised coatings beyond gold, nickel and copper layers for enhanced sensor production possibilities.

Wafer integration

Unlike conventional materials, our PEEK-based wafer can be moulded according to custom-specific requirements and integrated into the application. Even in small quantities, without compromising performance or efficiency.

Wafer individualisation

We take individual solutions to the next level: individual functions, shapes, quantities (even small quantities of wafers or sensors per wafer!) and sensor sizes are possible. 

Optimising existing components with TECAWAFER

With TECAWAFER, we offer a 4" wafer based on TECACOMP PEEK LDS as an alternative to silicon, ceramic, or glass wafers.
TECAWAFER is available in several variants, including biocompatible wafers. Learn more about the key benefits TECAWAFER offers compared to conventional wafer solutions.

  • LDS capability for simplified assembly & interconnection
  • Compatibility with wire bonding, thermo-compressive, reflow & conventional soldering on PVD thin film systems
  • High melting point and continuous operating temperature, enabling multiple processes, including reflow soldering
  • Recyclable materials for reduced CO2 footprint & characteristic material benefits of PEEK (thermal and mechanical)
  • Flexibility in shape and post processing capabilities

CUSTOMISED WAFER SOLUTIONS WITH TECAWAFER & EMST

In addition to the bare wafer, we also offer a comprehensive service along the entire wafer value chain, enabling you to make the most of the opportunities offered by Ensinger Microsystems Technology.
  • Individual functionalisation:  
    Choose from all the metals and alloys in the periodic table to create your customised functionalised sensor.
  • Individual size, batch, or form:
    We can cost-effectively manufacture sensors in a variety of batch sizes, in individual sizes and shapes for your customised solution. Additionally, TECAWAFER offers flexibility in the design tailored to specific installation conditions.
  • Individual integration options:
    Another novelty compared to conventional substrates is the free design of the substrate contour, which can be adapted to the specific installation space. The design and geometry of the bare wafers can be tailored to the customer's requirements and can therefore be flexibly adapted to the individual installation situation.
  • No more limits for sensor size, placement and packaging:
    TECAWAFER's customisable substrate contour simplifies Vertical Interconnect Access (VIA) contacting and enables novel packaging approaches by facilitating substrate bonding to polymer-based materials via laser welding, adhesive bonding or ultrasonic bonding, unlike traditional substrates such as ceramics or silicon.
  • Individual thin film structures:
    TECAWAFER's advanced patterning capabilities enable pre-structuring and cavity creation to address customer specific challenges with single digit micron resolution. This innovative polymer-based substrate streamlines processes by eliminating the need for complex etching, while our patented Ensinger Microsystems process enables the creation of customised microstructures, including sensor layouts and optical gratings, using all commercially available PVD coatings.

Technological Advantages of TECAWAFER: Transforming MEMS applications

TECAWAFER is revolutionising microsystems technology with a wide range of applications. Compatible with conventional lithography, PVD coatings and advanced structuring processes such as LDS, TECAWAFER facilitates the production of sensors, actuators and advanced microsystems, including GMR sensors with nanoscale layers. With TECAWAFER, we significantly shorten the value chain and ensure high delivery reliability with a standard portfolio available from stock. Made in Germany, TECAWAFER is a safe, sustainable and innovative solution for microsystems technology.

  • TECAWAFER has a particularly good surface roughness, achieved without any post-treatment. The standard surface roughness of TECAWAFER is at 20-30 nanometres Ra. For special applications, we can also realise roughnesses below 10 nanometres Ra. This allows us to achieve optimum surface qualities, suitable even for highly demanding applications such as those used in optics.

  • If desired, the TECAWAFER can be structured in advance and provide cavities that can give a solution to customer-specific challenges. Resolutions in the single-digit micrometer range can be achieved here. Complex etching processes such as Deep Reactive Ion Etching (DRIE) or similar processes used in silicon can be avoided. The polymer-based substrate TECAWAFER thus offers added value in terms of reducing steps in existing process chains.
  • A key advantage of EMST and TECAWAFER is the ability to build microsystems based on thin films. In this context, our PEEK-based wafer enables the realisation of customised coatings beyond gold, nickel and copper, as the thermal expansion coefficient of the bond to the substrate can be adapted to the metal used for the thin film. This allows innovative solutions to be created.
    Using standard processes such as PVD, TECAWAFER can be coated with customised thin films. In addition, we can produce highly complex thin film layouts using our patented Ensinger Microsystem Technology (EMST). These thin film systems can be used, for example, to produce sensors or actuators. Even highly sophisticated microsystems such as GMR sensors with their highly sensitive layers, some of which are only a few nanometres thick, can be realised on the TECAWAFER.

  •  TECAWAFER can be further processed by standard lithography, PVD or PECVD processes and structured by LDS processes. PVD coatings, CVD coatings and various other processes such as ALD or PECVD can applied for thin film systems. A combination of conventional lithography, PVD coating and now LDS structuring, known from 3D-MID technology, offers completely new possibilities for the assembly and interconnection of thin film based microsystems.

  • Unlike conventional wafers available on the market, TECAWAFER is also LDS compatible. This enables simple solutions in connection and interconnection technology (e.g. by applying LDS solder pads) or backside contacting through easy-to-implement VIAs (Vertical Interconnect Access). Furthermore, in the area of assembly and connection technology, it is worth mentioning that VIA contacting is particularly easy to implement in contrast to, e.g. silicon. In the area of packaging and interconnection technology, new approaches are possible. Joining the substrate with other polymer-based materials is possible using various processes such as laser welding, adhesive bonding or ultrasonic joining. This is a unique selling point compared to commonly known substrates such as ceramics or silicon, which cannot be joined using laser welding processes. 
  • Another special feature of TECACOMP PEEK LDS is that thin-wire bonding or thermo-compressive and conventional soldering processes can be carried out even on PVD thin-film systems. 

  • By using the high performance polymer PEEK, TECAWAFER is chemically and temperature resistant, and electrically insulating. PEEK is also not thermally conductive to the same extent as silicon, glass or ceramics. As a result, TECAWAFER offers additional material-specific advantages compared to the conventional wafers available on the market.

    Unlike conventional substrates, thermoplastic PEEK can be recycled. TECAWAFER is also much less energy intensive to produce than, for example, silicon, glass or ceramics. This also supports the sustainability goals of many applications and industries.

Join the EMST Revolution

If you are interested in breaking new ground in the field of microsystems technology and in exploring the possibility of customising your substrate or the possibilities of innovative assembly and interconnection technology, please contact us. We are looking forward to creative applications for our TECAWAFER.

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