TECACOMP PEEK MED LDS grey 1067594
LDS PEEK compound for medical applications
TECACOMP PEEK MED LDS grey is a functionally modified PEEK compound based on the high-performance PEEK polymer polyetheretherketone (PEEK), specifically developed for medical electronic components with direct conductor track structuring. The material is laser-activatable and enables selective surface functionalisation for metallisation via the LDS (laser direct structuring) process, offering a reliable substrate for electronic integration in PEEK plastic injection moulding.
In addition to LDS capability, this PEEK composite is characterised by excellent thermoplastic processability, weldability, and structural integrity under continuous thermal stress. It delivers stable performance up to 260 °C, with high dimensional accuracy and reliability in multi-cavity or multi-component PEEK injection moulding.
Other material advantages include inherent flame resistance (UL94 V-0), very low water absorption, minimal outgassing, and outstanding chemical resistance. These properties make the compound ideal for demanding, hygiene-critical, sterilisable, or media-loaded environments.
TECACOMP PEEK MED LDS grey is used wherever conductive structures need to be directly integrated into dimensionally stable medical components. Typical applications include sensor-integrated housings, conductive functional interfaces, or microstructured carrier systems in advanced medical technology. Within the Ensinger portfolio of PEEK grades, this material provides a robust, process-safe platform for hybrid electronic solutions, complementing other high-performance PEEK resin products such as PEEK sheet or PEEK plate.
In addition to LDS capability, this PEEK composite is characterised by excellent thermoplastic processability, weldability, and structural integrity under continuous thermal stress. It delivers stable performance up to 260 °C, with high dimensional accuracy and reliability in multi-cavity or multi-component PEEK injection moulding.
Other material advantages include inherent flame resistance (UL94 V-0), very low water absorption, minimal outgassing, and outstanding chemical resistance. These properties make the compound ideal for demanding, hygiene-critical, sterilisable, or media-loaded environments.
TECACOMP PEEK MED LDS grey is used wherever conductive structures need to be directly integrated into dimensionally stable medical components. Typical applications include sensor-integrated housings, conductive functional interfaces, or microstructured carrier systems in advanced medical technology. Within the Ensinger portfolio of PEEK grades, this material provides a robust, process-safe platform for hybrid electronic solutions, complementing other high-performance PEEK resin products such as PEEK sheet or PEEK plate.