LCP-Compounds-TECACOMP-LCP-LDS-black
LCP-Compounds-TECACOMP-LCP-LDS-black

TECACOMP LCP LDS black 1049426

Liquid crystal compound for filigree components with laser direct structuring

This compound, based on a thermoplastic liquid crystal polymer (LCP), has a low viscosity in the melt and enables the production of filigree components with high stiffness and low wall thickness. Additives optimise the coefficient of thermal expansion toward copper and increase thermal conductivity. The mechanical and thermal properties become significantly more isotropic through the addition of mineral fillers.

TECACOMP LCP LDS black 1049426 is reflow solderable and offers good metallizability and adhesion of the conductor tracks. With laser direct structuring (LDS), the smallest conductor path distances (fine pitch), high edge sharpness as well as through-hole plating (via) with a very small aspect ratio is possible. The compound can be used permanently up to 200 °C, and even up to 260 °C for short periods.  

The very low water absorption of the plastic compound ensures high dimensional and thermal stability. It also impresses with its excellent electrical insulating properties and very good chemical resistance as well as inherent flame resistance. Applications include sensors, 3D antennas in smartphones or radar systems, AVT components, safety elements or LED components. 

LDS components are mainly used in automotive and mechanical engineering and in electrical and lighting engineering. Ensinger supports customers early on in the project planning phase and, as a member of 3D MID, is involved in industry-related research projects. Moldflow data and sample plates (80 x 80 x 3 mm) for laser and metallization tests as well as tensile test bars are available for TECACOMP LCP LDS.

 

Facts

Chemical designation
LCP (Liquid crystal polymer)
Colour
black
Density
1.74 g/cm3

Main Features

  • developed for the LPKF-LDS® process
  • very low melt viscosity
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption

Target industries

Downloads

Technical details

products_technical_additionalnote_

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 85 MPa DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    9600 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 1,6 % DIN EN ISO 527-1
    Impact strength (Charpy) 15 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Melting temperature 310 C -
    Heat distortion temperature 221 C ISO-R 75 Method A
    Service temperature 260 C short term -
    Service temperature 200 C long term -
    Thermal expansion (CLTE) 8 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 34 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 11 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 44 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 14 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 53 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 13 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 64 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal conductivity 2,1 W/(k*m) in-plane ISO 22007-4:2008
    Thermal conductivity 0,5 W/(k*m) through-plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1015 O DIN EN 61340-2-3
    volume resistivity 1015 O*m DIN EN 61340-2-3
    Dielectric loss factor 0,0052 test frequency of 1 GHz -
    Dielectric constant 3,5 test frequency of 1 GHz -
    Resistance to tracking (CTI) 150 V DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Molding shrinkage 0,03 % longitudinal DIN EN ISO 294-4
    Molding shrinkage 0,56 % transverse DIN EN ISO 294-4
    Water absorption 0,1 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 - 3,2 mm DIN IEC 60695-11-10;
  • product-technical-detail-collapse-item-4-lvl-1
    Processing parameter Value Unit Parameter Norm
    Mould temperature 130 C -
  • product-technical-detail-collapse-item-5-lvl-1
    Predrying Value Unit Parameter Norm
    Permissible residual moisture content 0,01 % -
    Drying temperature 150 C -
    Drying time 5 h -