LCP-Compounds-TECACOMP-LCP-LDS-black

TECACOMP LCP LDS black 1014978

Liquid crystal compound for fine components with laser direct structuring

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Injection molded part

TECACOMP LCP LDS black is a reflow-capable liquid crystal polymer resin based on a thermoplastic LCP polymer with extremely low melt viscosity. This advanced LCP resin allows the precise molding of microstructured components with high rigidity and very low wall thicknesses. Optimised additives reduce the coefficient of thermal expansion in the direction of copper, improve thermal conductivity, and – together with mineral fillers – ensure largely isotropic material performance.
The LDS-compatible LCP plastic resin enables the production of extremely fine conductor track structures with sharp edges as well as microstructured via through-plating. The compound provides long-term thermal stability up to 200 °C (and short-term up to 260 °C), very low water absorption, and excellent insulating properties, while its inherent flame resistance ensures safety in critical environments.
Thanks to its strong chemical resistance and reliable electrical performance, TECACOMP LCP LDS black is ideally suited for demanding electronic functional parts such as 3D antennas, sensor carriers, or LED components. Its combination of precision moulding capability, thermal stability, and functional  performance makes this liquid crystal polymer resin an outstanding solution for applications in automotive, electronics, and lighting industries.

 

Compliances

Facts

Chemical designation
LCP (Liquid crystal polymer)
Colour
black
Density
1.75 g/cm3

Main Features

  • developed for the LPKF-LDS® process
  • low thermal expansion

Target industries

electrical engineering
mechanical engineering
automotive industry
LED lighting technology

Downloads

Datasheet (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 93 MPa DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)    		 10500 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 1,3 % DIN EN ISO 527-1
    Impact strength (Charpy) 8 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Melting temperature 320 C DIN 53765
    Heat distortion temperature 274 C HDT A ISO-R 75 Method A
    Thermal expansion (CLTE) 16 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 32 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 25 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 40 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 30 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 49 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 34 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 60 106*K-1 transverse DIN EN ISO 11359-1;2
    Specific heat 1,25 J/(g*K) DIN EN 821
    Thermal conductivity 1,61 W/(k*m) in-plane ISO 22007-4:2008
    Thermal conductivity 0,76 W/(k*m) through-plane ISO 22007-4:2008
    Thermal diffusivity 0,93 mm2/s in-plane ISO 22007-4:2008
    Thermal diffusivity 0,31 mm2/s through-plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 4,1 x 1012 Ω DIN EN 61340-2-3
    volume resistivity 3,8 x 1011 Ω*m DIN EN 61340-2-3
    Dielectric loss factor 0,003 test frequency of 1 GHz -
    Dielectric constant 3,52 test frequency of 1 GHz -
    Resistance to tracking (CTI) 275 V DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Water absorption 0,1 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 3,0 mm DIN IEC 60695-11-10;
    Adhesive strength (metal path) 9,1 N/mm2 -
    Laser Marking Parameter 2 - 5 W Power -
    Laser Marking Parameter 100 - 200 kHz Frequency -
    Laser Marking Parameter 1,6 - 3,2 m/s Forward movement -
  • product-technical-detail-collapse-item-4-lvl-1
    Processing parameter Value Unit Parameter Norm
    Cylinder/processing temperature 320 - 340 C -
    Nozzle temperature 350 C -
    Injection pressure 1500 bar -
    Zone 1 320 C -
    Zone 2 325 C -
    Zone 3 330 C -
    Zone 4 340 C -
    Mould temperature 160 C -
    Injection rate fast - -
    Back pressure 1 - 3 bar -
    hold pressure 300 - 600 bar -
  • product-technical-detail-collapse-item-5-lvl-1
    Predrying Value Unit Parameter Norm
    Permissible residual moisture content 0,1 % -
    Drying temperature 150 C -
    Drying time 3 - 5 h -