TECASUB PEEK LDS grey

The first grey LDS-capable film substrate

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TECASUB PEEK LDS grey is an innovative LDS-capable film substrate that offers flexible design options for complex industrial applications. It has the same advantageous properties as TECASUB PEEK LDS black and expands the portfolio with a grey variant. The formulation of the raw material is biocompatible, making it easier to access applications in the medical market.

The film substrate is a resource-efficient alternative to polyimide film substrates, providing excellent thermal stability and enabling resource-conserving production processes. Our expert team is available for personalised consultations.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
grey
Density
1.65 g/cm3

Main Features

  • lithography capable
  • PVD / CVD capable
  • wirebonding possibile
  • electroplating possible
  • developed for the LPKF-LDS® process
  • reflow soldering possible
  • inherent flame retardant
  • low moisture absorption

Target industries

MEMS technology
sensor technology
semiconductor technology
electronics
interposer technology
cleanroom technology

Downloads

Datasheet (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    General material information Value Unit Parameter Norm
    Width 10 - 630 mm -
    Surface Roughness Ra 0,1 micro -
    thickness 100 - 1000 +-25 micro -
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    Mechanical properties Value Unit Parameter Norm
    Tensile strength 103 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 2,3 % DIN EN ISO 527-1
    Impact strength (Charpy) 30 kJ/m2 DIN EN ISO 179-1eU
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    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 143 C -
    Melting temperature 343 C -
    Service temperature 300 C short term -
    Service temperature 260 C long term -
    Thermal expansion (CLTE) 31 106*K-1 in plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 18 106*K-1 perpendicular to the plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 87 106*K-1 in plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 47 106*K-1 perpendicular to the plane DIN EN ISO 11359-1;2
    Specific heat 0,8 J/(g*K) DIN EN 821
    Thermal conductivity 1,2 W/(k*m) in plane ISO 22007-4:2008
    Thermal conductivity 0,5 W/(k*m) perpendicular to the plane ISO 22007-4:2008
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    Electrical properties Value Unit Parameter Norm
    surface resistivity 1* 1014 Ω DIN EN 61340-2-3
    Dielectric strength 17,5 kV/mm 70 mm x 70 mm x 3 mm ISO 60243-1
    Dielectric loss factor 0,002 test frequency of 1 GHz -
    Dielectric constant 3,6 test frequency of 1 GHz -
    Resistance to tracking (CTI) 225 V DIN EN 60112
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    Other properties Value Unit Parameter Norm
    Water absorption 0,04 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 - at 0,8 mm DIN IEC 60695-11-10;
    Adhesive strength (metal path) 19,4 N/mm2 -