PEEK filament TECAFIL PEEK LDS black 655px
PEEK filament TECAFIL PEEK LDS black 655px
293.00 EUR

TECAFIL PEEK LDS black - 1.75 mm

PEEK LDS (Laser Direct Structuring) Filament

As a specialist for highly modified materials and solutions in various industries, we offer a new solution for 3D printing with PEEK for the electronics industry.
As the world's only certified supplier of a PEEK LDS at LPKF Laser & Electronics AG, we offer a PEEK filament that can be modified by laser direct structuring (LDS). Together with our own compounding department and its extensive experience with materials for laser direct structuring, we were the first company in the world to develop a PEEK filament with LDS feature.
With the MID (Molded Interconnect Devices) process and the conductive tracks generated on the application, both functional and solid components such as smartphone housings with integrated antennas can be combined.
The metallization properties of our TECAFIL PEEK LDS black are comparable to those of injection molded PEEK LDS compound, despite a rougher surface due to additive manufacturing.
This has been confirmed to us by the Hahn Schickard Institute of Engineering.

Why use PEEK 3D printing filament with LDS feature?
PEEK filament prices are relatively high compared to standard or engineering plastics. But with the ideal properties of PEEK filament in terms of high thermal stability, good adhesion, high weld line strength and good chemical resistance, printing PEEK offers enormous advantages and, unlike other filaments, opens up a whole new range of applications.
The heat resistance of PEEK allows PEEK with LDS addition, reflow soldering and direct assembly of the application.
In addition, coating by hole bonding is also possible with this filament.
Thus, this PEEK filament offers enormous advantages for LDS components, as functional prototypes and small series can be produced with a 3D printer without the need to invest in an injection mold. PEEK LDS is generally known for applications such as sensors, antennas or safety components. 

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
black
Density
1.67 g/cm3 (*2)

Main Features

  • developed for the LPKF-LDS® process

Target industries

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    General material information Value Unit Parameter Norm
    Diameter 1,75 +/- 0,05 mm -
    Spool measurements Ø 52 mm holder -
    Spool measurements 55 mm width -
    Spool measurements Ø 200 mm outer diameter -
    Spool Material Polycarbonate - -
    Filament Load per Spool 500 g -
  • product-technical-detail-collapse-item-1-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 105 MPa 50 mm/min DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    10900 MPa 50 mm/min DIN EN ISO 527-1
    Elongation at break (tensile test) 2,5 % 50 mm/min DIN EN ISO 527-1
    Flexural strength - MPa 2 mm/min, 10 N DIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    - MPa 2 mm/min, 10 N DIN EN ISO 178
  • product-technical-detail-collapse-item-2-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 143 C ASTM D 3418
    Melting temperature 343 C DIN EN ISO 11357
    Deflection temperature 218 C HDT-A ISO-R 75 Method A
    Service temperature 300 C short term -
    Service temperature 260 C long term -
    Thermal expansion (CLTE) 18 106*K-1 longitudinal (at 23 - 100 °C) DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 26 106*K-1 transverse (at 23 - 100 °C) DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 46 106*K-1 longitudinal (at 200 - 260 °C) DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 67 106*K-1 transverse (at 200 - 260 °C) DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 63 106*K-1 longitudinal (at 260 - 300 °C) DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 88 106*K-1 transverse (at 260 - 300 °C) DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-3-lvl-1
    Electrical properties Value Unit Parameter Norm
    Surface resistivity 5,8 x 1012 O DIN EN 61340-2-3
    Dielectric strength 17,5 kV/mm 70mm x 70mm x 3mm ISO 60243-1
    Dielectric loss factor 0,0066 - test frequency of 1 kHz DIN 53483-1
    Dielectric constant 3,73 - test frequency of 1 kHz DIN 53483-1
  • product-technical-detail-collapse-item-4-lvl-1
    Other properties Value Unit Parameter Norm
    Moisture absorption 0,1 % DIN EN ISO 62
    Melt flow index (MFI) 77,0 g/10 min 380°C / 10kg DIN EN ISO 1133
  • product-technical-detail-collapse-item-5-lvl-1
    Processing parameter Value Unit Parameter Norm
    Nozzle temperature 390 - 420 C -
    Max. melt temperature 430 C -
    Print bed temperature 160 - 250 C -
    Build chamber temperature 160 - 230 C -
    Nozzle diameter 0,4 mm -
    Print speed 20 - 30 mm/s -
    Fan speed 0 % -
  • product-technical-detail-collapse-item-6-lvl-1
    Predrying Value Unit Parameter Norm
    Drying temperature 120 C -
    Drying time 8 h -