TECASINT 5051 grey-green

With 30 % glass fibre

Starting with the base polymer TECASINT 5111, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 330°C, while the maximum service temperature may be – for a short time – up to 300 °C.

Facts

Colour
dark brown
Density
1,56 g/cm3

Main Features

  • high thermal and mechanical capacity
  • very good electrical insulation
  • good wear properties
  • low thermal expansion
  • resistance against high energy radiation
  • high creep resistance
  • good chemical resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Impact strength (Charpy) 20 kJ/m2 max 7.5 J, 23°C DIN EN ISO 179-1
    Shore hardness 92 - Shore D, 23°C -
    Tensile strength 110 MPa 50 mm/min, 23°C DIN EN ISO 527-1
    Elongation at break (tensile test) 2.2 % 50 mm/min, 23°C DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    6500 MPa 1 mm/min, 23°C DIN EN ISO 527-1
    Flexural strength 162 MPa 10 mm/min, 23°C DIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    6600 MPa 2 mm/min, 23°C DIN EN ISO 178
    Compression strength 260 MPa 10 mm/min, 23°C EN ISO 604
    Compression modulus 3000 MPa 1 mm/min, 23°C EN ISO 604
    Elongation at break (tensile test) 2.6 % 10 mm/min, 23°C DIN EN ISO 178
    Compressive strain at break 20 % 10 mm/min, 23°C EN ISO 604
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 330 C -
    Service temperature 300 C short-term -
    Thermal expansion (CLTE) - 10-5*1/K 50-200°C DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) - 10-5*1/K 23-100°C DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) - 10-5*1/K 100-150°C DIN EN ISO 11359-1;2
    Thermal conductivity W/(k*m) 40°C DIN EN 821
    Specific heat J/(g*K) DIN EN 821
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    Dielectric constant 3.0 - 50 Hz, 23 °C DIN 53483-1
    surface resistivity 1014 O 23°C DIN EN 61340-2-3
    Dielectric constant 2.9 - 1 kHz, 23°C DIN 53483-1
    volume resistivity > 1014 O*cm 23°C DIN EN 61340-2-3
    Dielectric constant 2.9 - 1 MHz, 23 °C DIN 53483-1
    Dielectric loss factor 3.2*10-2 - 50 Hz, 23 °C DIN 53483-1
    Electric strength DC 24 kV*mm-1 ISO 60243-1
    Dielectric loss factor 2.2*10-3 - 1 kHz, 23°C DIN 53483-1
    Dielectric loss factor 1.1*10-2 - 1 MHz, 23 °C DIN 53483-1
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Water absorption 0.48 % 24 h in water, 23°C DIN EN ISO 62
    Water absorption 1.66 % 24 h in water, 80°C DIN EN ISO 62
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    HZ-Catalogue yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    Water absorption % 24h (23°C) DIN EN ISO 62

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