2016-09-27 / Press Release

K 2016: EMI compounds developed by Ensinger

Plastic housings made from shielding compounds provide protection against electromagnetic interference (EMI)

At the K 2016 fair in Düsseldorf, Ensinger is presenting its newly developed compounds for plastic housings with a shielding function. By incorporating absorbent fillers, Ensinger has succeeded in smoothing out room resonances and thereby significantly minimising drops in shielding effectiveness. Ensinger Sintimid GmbH, Ensinger Compounds division, is exhibiting at the K trade fair between 19 and 26 October 2016 in Hall 6/Stand E79. 

Electromagnetic compatibility is a must

Current technologies require more and more electronics in a small installation space, while the output densities and frequencies of electrical components are increasing. Developers are faced with the challenge of designing components in such a way that devices do not interfere with each other through electromagnetic waves. With metal and metal-coated housings, and likewise with plastics designed to be conductive, there is the risk of multiple reflections (room resonances) particularly at higher frequencies. These result in drops in shielding effectiveness at different frequencies and may lead to malfunctions or jeopardise operational safety. The new Ensinger TECACOMP EMI compounds avoid drops in shielding effectiveness; this is achieved by absorbent additives in the plastic preventing the penetrating waves from being reflected back again.

All electrical and electronic devices must be tested for electromagnetic compatibility (EMC) before operation in order to receive a CE mark. The new compounds from Ensinger make it easier to pass the CE test thanks to greater operational safety, also at higher frequencies. 

TECACOMP EMI: Advantages over previous solutions

With TECACOMP EMI, Ensinger is providing users with a novel material for housing technology which has additional advantages vis-a-vis metal housings or metal-coated, plastic housings: Thanks to the injection-moulding process there is complete freedom with regard to the design, complex structural shapes are also possible. The shielding function is present directly after the injection moulding - no additional work steps are required to apply a shielding layer. In addition, no post-treatments such as deburring or the application of bosses are needed. The injection-moulding process also makes it possible to produce large quantities economically.

TECACOMP EMI compounds offer reliable shielding properties irrespective of possible fluctuations in layer thickness. There is no impairment of the effect as a result of scratches or flaking-off. Protection from electrostatic discharge (ESD) is provided by the material as a whole, not only by a metal-coated surface. Compared with metal housings, plastic housings made from shielding compounds also generate significant weight savings.


About Ensinger

The Ensinger group is engaged in the development, manufacture and sale of compounds, semi-finished materials, profiles and technical parts made of engineering and high performance plastics through extrusion, machining and injection moulding. With a total of 2,300 employees at 28 locations, the family-owned enterprise is represented worldwide in all major industrial regions with manufacturing facilities or sales offices.

TECACOMP EMI: At the K 2016 fair in Düsseldorf, Ensinger is presenting its newly developed compounds for plastic housings with a shielding function. By incorporating absorbent fillers, Ensinger has succeeded in smoothing out room resonances and thereby significantly minimising drops in shielding effectiveness.

Your Contact for Editorial Questions

Jörg Franke

Ensinger GmbH
Phone: +49-7032-819-202
E-Mail: [obfemailstart]ai5mcmFua2VAZGUuZW5zaW5nZXItb25saW5lLmNvbQ==[obfemailend]


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