TECAPOWDER PI STD yellow -200 mesh
TECAPOWDER PI powder as binder resin in CBN and diamond grinding wheels, -200 mesh
TECAPOWDER PI STD yellow -200 mesh is used as a binder in CBN and diamond grinding wheels. Polyimides offer the highest thermal stability compared to other polymers. The very high demands on the bonding resin in high quality diamond grinding wheels in terms of stability, strength and temperature resistance cannot be met by polyamides, epoxides and polyether ketones.
Bonded TECAPOWDER-PI grinding wheels are extremely resilient due to their excellent thermal stability. They are particularly suitable for applications in hard metal machining (dry) and deep grinding (wet). They often achieve twice the grinding speeds of standard epoxy or phenolic grinding wheels.
Bonded TECAPOWDER-PI grinding wheels are extremely resilient due to their excellent thermal stability. They are particularly suitable for applications in hard metal machining (dry) and deep grinding (wet). They often achieve twice the grinding speeds of standard epoxy or phenolic grinding wheels.