TECACOMP PEEK LDS grey 1061958
Laser direct structurable PEEK compound with light inherent colour
The laser-structurable PEEK compound TECACOMP PEEK LDS grey is based on the high-performance PEEK polymer polyetheretherketone (PEEK) and was developed for electronic functional parts with integrated conductor track layouts. Through targeted material modification, the surface can be selectively activated for the laser direct structuring process, enabling the creation of extremely fine conductor tracks directly in PEEK plastic injection moulding.
In addition to high thermal resistance, the specialised PEEK resin offers optimised thermal expansion aligned with copper and improved thermal conductivity. This makes the PEEK compound particularly suitable for electronic components with demanding thermomechanical requirements. Its high dimensional stability ensures reliable processes during structuring, metallisation, and assembly.
The light-colored PEEK granules are especially useful in visually sensitive applications such as sensor or lighting technology. Batch compatibility also allows individual color matching in PEEK injection moulding, supporting variant identification or color-coded functional elements.
Thanks to optimised flow properties and reduced deposit formation, the compound is well-suited for complex geometries with fine structures, openings, or thin wall sections. Even at continuous operating temperatures up to 260 °C, the material demonstrates excellent chemical resistance, low water absorption, and flame retardancy (UL94 V-0).
Typical applications include structured carrier materials for sensor systems, safety-critical housing parts, or microstructured components. Compared to conventional materials, this laser-activatable PEEK grade offers improved weld seam strength, making it ideal for critical transitions and bores in PEEK injection moulding. Within Ensinger’s portfolio, it complements other high-performance PEEK plates and PEEK sheets for advanced engineering solutions.
In addition to high thermal resistance, the specialised PEEK resin offers optimised thermal expansion aligned with copper and improved thermal conductivity. This makes the PEEK compound particularly suitable for electronic components with demanding thermomechanical requirements. Its high dimensional stability ensures reliable processes during structuring, metallisation, and assembly.
The light-colored PEEK granules are especially useful in visually sensitive applications such as sensor or lighting technology. Batch compatibility also allows individual color matching in PEEK injection moulding, supporting variant identification or color-coded functional elements.
Thanks to optimised flow properties and reduced deposit formation, the compound is well-suited for complex geometries with fine structures, openings, or thin wall sections. Even at continuous operating temperatures up to 260 °C, the material demonstrates excellent chemical resistance, low water absorption, and flame retardancy (UL94 V-0).
Typical applications include structured carrier materials for sensor systems, safety-critical housing parts, or microstructured components. Compared to conventional materials, this laser-activatable PEEK grade offers improved weld seam strength, making it ideal for critical transitions and bores in PEEK injection moulding. Within Ensinger’s portfolio, it complements other high-performance PEEK plates and PEEK sheets for advanced engineering solutions.