TECASINT 5501 ESD light-brown

Polyimide with defined electrostatic dissipative properties

TECASINT 5501 ESD light-brown is an electrically modified polyimide based on the further development of TECASINT 5111. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 106-108 ohm. The ESD material is therefore ideally suited for applications where electrostatic dissipation is to be ensured.

Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance.

The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics or in nuclear and vacuum technology. Furthermore, PI plastic is also resistant to high-energy radiation.

TECASINT 5501 ESD light-brown is produced in the shape of polyimide sheets.

Facts

Chemical designation
PI (Polyimide)
Colour
brown
Density
1,68 g/cm3

Main Features

  • electrically static dissipative
  • high thermal and mechanical capacity
  • low thermal expansion
  • high creep resistance
  • resistance against high energy radiation

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Ball indentation hardness 375 MPa ISO 2039-1
    Compressive strain at break 20 % 10 mm/min, 23°C EN ISO 604
    Elongation at break (tensile test) 2.7 % 10 mm/min, 23°C DIN EN ISO 178
    Compression strength 260 MPa 10 mm/min, 23°C EN ISO 604
    Modulus of elasticity
    (flexural test)
    6900 MPa 2 mm/min, 23°C DIN EN ISO 178
    Flexural strength 127 MPa 10 mm/min, 23°C DIN EN ISO 178
    Modulus of elasticity
    (tensile test)
    7000 MPa 1 mm/min, 23°C DIN EN ISO 527-1
    Elongation at break (tensile test) 1.5 % 50 mm/min, 23°C DIN EN ISO 527-1
    Tensile strength 93 MPa 50 mm/min, 23°C DIN EN ISO 527-1
    Shore hardness 93 - Shore D, 23°C -
    Impact strength (Charpy) 16.1 kJ/m2 max 7.5 J, 23°C DIN EN ISO 179-1
    Rockwell hardness 119 - M ISO 2039/2
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Thermal expansion (CLTE) 2.6 10-5*1/K 23-100°C DIN 53 752
    Thermal expansion (CLTE) 2.9 10-5*1/K 50-200°C DIN 53 752
    Service temperature 300 C short-term -
    Glass transition temperature 329 C DIN EN ISO 11357
    Thermal expansion (CLTE) 2.9 10-5*1/K 100-150°C DIN 53 752
    Thermal conductivity 0.34 W/(k*m) 40°C DIN EN 821
    Specific heat 1.04 J/(g*K) DIN EN 821
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    volume resistivity 108 O*cm 23°C DIN EN 61340-2-3
    surface resistivity 108 O 23°C DIN EN 61340-2-3
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Water absorption 0.33 % 24h / 96h (23°C) DIN EN ISO 62
    HZ Semicon brochure yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ-Catalogue yes - -
    Water absorption 1.55 % 24 h in water, 80°C DIN EN ISO 62
    Water absorption 0.63 % 24 h in water, 23°C DIN EN ISO 62
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;

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