TECAPEEK CMP natural

PEEK for CMP applications

TECAPEEK CMP is a Victrex® PEEK polymer specially modified for applications in the semiconductor industry, and more specfically for parts in CMP (chemical mechanical planarization) equipment. The material maintains the outstanding property profile inherant to PEEK, which includes high mechanical strength and dimensional stability for tightest part tolerances, along with a low tendency to creep. TECAPEEK CMP is of a higher purity level than standard TECAPEEK. This combined with excellent chemical resistance and specially improved abrasion and friction characteristics, rounds out the property profile of this PEEK CMP modification.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Color
beige
Density
1,31 g/cm3

Main Features

  • good heat deflection temperature
  • good machinability
  • inherent flame retardant
  • hydrolysis and superheated steam resistant
  • resistance against high energy radiation
  • good slide and wear properties
  • high toughness
  • high creep resistance

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Compression strength 34 MPa 1% / 2% EN ISO 604
    Modulus of elasticity
    (flexural test)
    3900 MPa 2mm/min, 10 N DIN EN ISO 178
    Flexural strength 160 MPa 2mm/min, 10 N DIN EN ISO 178
    Elongation at break (tensile test) 50 % 50mm/min DIN EN ISO 527-2
    Tensile strength at yield 110 MPa 50mm/min DIN EN ISO 527-2
    Elongation at yield (tensile test) 4 % 50mm/min DIN EN ISO 527-2
    Modulus of elasticity
    (tensile test)
    4100 MPa 1mm/min DIN EN ISO 527-2
    Tensile strength 110 MPa 50mm/min DIN EN ISO 527-2
    Ball indentation hardness 240 MPa ISO 2039-1
    Impact strength (Charpy) n.b. kJ/m2 max. 7,5J DIN EN ISO 179-1eU
    Compression modulus 3200 MPa 5mm/min, 10 N EN ISO 604
    Notched impact strength (Izod) 4 kJ/m2 DIN EN ISO 179-1eA
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Thermal expansion (CLTE) 6 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 5 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Service temperature 260 C long term NN
    Heat distortion temperature 162 C HDT, Method A ISO-R 75 Method A
    Service temperature 300 C short term NN
    Melting temperature 340 C DIN EN ISO 11357
    Glass transition temperature 151 C DIN EN ISO 11357
    Thermal conductivity 0.27 W/(k*m) ISO 22007-4:2008
    Specific heat 1.1 J/(g*K) ISO 22007-4:2008
    Thermal expansion (CLTE) 7 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1015 O Silver electrode, 23°C, 12% r.h. DIN IEC 60093
    volume resistivity 1015 O*cm Silver electrode, 23°C, 12% r.h. DIN IEC 60093
    Dielectric strength 73 kV/mm 23°C, 50% r.h. ISO 60243-1
    Resistance to tracking (CTI) 125 V Platin electrode, 23°C, 50% r.h., solvent A DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Resistance to hot water/ bases + - -
    Resistance to weathering - - -
    HZ Semicon brochure yes - -
    Water absorption 0.03 % 24h / 96h (23°C) DIN EN ISO 62
    HZ-Catalogue no - -

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