Pure and resistant.
Plastics for any environment

Plastic material solutions for the semiconductor industry

Of all the industries in which engineering plastics can help engineers solve design problems, none is more challenging than the semiconductor industry. Our semiconductor industry plastics are designed with the industry's often rigid and demanding environmental concerns in mind. In addition to this, our semiconductor industry specialists work directly with engineers to understand the unique challenges associated with every aspect of the semiconductor manufacturing process - from the beginning of the wafer processing cycle, through chip processing and handling, to packaging. 

Each stage of the process offers its own set of difficulties, from extremely high temperatures, to exposure to highly aggressive chemicals, contact with abrasive solvents and environments of plasma under a vacuum. Ensinger has a plastic semiconductor solution to suit every environment and meets the strictest requirements for design and machining tolerance, outgassing, and contamination specifications. Our design solutions cost less than traditional materials, such as ceramics or quartz, and are generally much easier to work with.

Benefits FOR THE Semiconductor industry

Extensive product range, engineering support and testing capabilities

Manufacturing and process flexibility ranging from compression molding for short run parts or concept testing, to extrusion for medium run machined parts, and even including injection molding capabilities for high volume parts to help engineers meet rapidly changing industry needs and technology advances
Global presence with manufacturing capabilities in North and South America, Europe, and Asia.

Customer specific, industry and government agency compliance expertise

Strategic vendor alliances with premier resin suppliers worldwide

Solutions for THE Semiconductor Industry

Special materials for CMP

The Chemical Mechanical Planarization (CMP) process is one of the key steps in silicone wafer production. Ensinger offers a number of solutions to suit this process, which can vary greatly from one equipment manufacturer to another.

Low outgassing plastics

For certain industries such as semiconductors, aircraft and energy, there are strict requirements for the purity of plastics with regard to outgassing and the presence of ionic purities. Ensinger offers plastics with these requirements. 

High temperature plastics

High temperature plastics are under constant development and are becoming increasingly common in high-end semiconductor applications due to chip designs becoming ever more complex, thus requiring long-term resistance to high temperature exposure.

ESD plastics

Unmodified plastics are generally electrically insulating, but thermoplastics such as PEEK and Acetal can be modified to provide a range of electrically conductive, anti-static or static dissipative properties. These characteristics are important for semiconductor applications such as back-end test sockets.

Chemical resistance

Chemical compatibility, chemical resistance, and corrosion resistance are among the greatest advantages of plastics when compared to metals, and can be especially important to semiconductor end users, who use a variety of chemicals in various stages of the chip manufacturing process.

Machinable Plastics for THE Semiconductor Industry

TECAPEEK natural

Polyetheretherketone (PEEK) - TECAPEEK natural is a high performance, high temperature, semi-crystalline thermoplastic manufactured by Ensinger...

TECAPEI GF30 glass filled Ultem

TECAPEI GF30 is a 30% glass fibre reinforced PEI. The material has high rigidity, very high mechanical strength, extremely good dimensional stability and resistance to high-energy radiation.

TECATRON natural

Polyphenylenesulphide (PPS) - TECATRON - is a high temperature thermoplastic. PPS is a very resistant polymer with high mechanical strength and rigidity ...
Other materials for semiconductor industry:
  • TECAPEEK ELS nano black
  • TECAPEEK CMP natural
  • TECASINT 5051 green-grey
  • TECASINT 4111 natural
  • TECASINT 4011 natural
  • TECAPEI natural

Semiconductor Industry CASE STUDIES

PPS Retaining ring TECATRON CMP natural

CMP Retaining Ring


How to meet the numerous requirements of CMP process

A very important step in silicon wafer production, is the Chemical Mechanical Planarization (CMP) process. The trend is towards larger wafer sizes, smaller chips with narrower line widths and feature sizes. The challenge is to find a material with the desired characteristics, as the CMP process requires components made of highly qualified materials. In close cooperation with customers, we have specialised in developing materials that meet these requirements.