TECASINT 5051 grey-green

Polyamidimide with 30 % glass fibre

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.


Chemical designation
PAI (Polyamide-imide)
# dark brown
1,57 g/cm3

Main Features

  • high thermal and mechanical capacity
  • very good electrical insulation
  • good wear properties
  • low thermal expansion
  • resistance against high energy radiation
  • high creep resistance
  • good chemical resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

aircraft and aerospace technology
cryogenic engineering
electrical engineering
mechanical engineering
nuclear and vacuum technology

Technical details

Stock program