TECASINT 5051 grey-green

Polyamidimide with 30 % glass fibre

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.


Chemical designation
PAI (Polyamide-imide)
dark brown
1,57 g/cm3

Main Features

  • high thermal and mechanical capacity
  • very good electrical insulation
  • good wear properties
  • low thermal expansion
  • resistance against high energy radiation
  • high creep resistance
  • good chemical resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Notched impact strength (Charpy)5.1kJ/m2max 7.5 J, 23°CDIN EN ISO 179-1eA
    Impact strength (Charpy)27.3kJ/m2max 7.5 J, 23°CDIN EN ISO 179-1eU
    Shore hardness92DShore D, 23°CDIN 53505
    Tensile strength94MPa50 mm/min, 23°CDIN EN ISO 527-1
    Elongation at break3.4%50 mm/min, 23°CDIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    5800MPa1 mm/min, 23°CDIN EN ISO 527-1
    Flexural strength163MPa10 mm/min, 23°CDIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    6625MPa2 mm/min, 23°CDIN EN ISO 178
    Compression strength260MPa10 mm/min, 23°CEN ISO 604
    Compression modulus2590MPa1 mm/min, 23°CEN ISO 604
    Elongation at break3.1%10 mm/min, 23°CDIN EN ISO 178
    Compressive strain at break72%10 mm/min, 23°CEN ISO 604
    Ball indentation hardness360MPaISO 2039-1
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Glass transition temperature340C-
    Service temperature300Cshort-term-
    Thermal expansion (CLTE)-10-5*1/K50-200°CDIN 53 752
    Thermal expansion (CLTE)-10-5*1/K23-100°CDIN 53 752
    Thermal expansion (CLTE)-10-5*1/K100-150°CDIN 53 752
    Thermal conductivity0.4W/(k*m)40°C-
    Specific heat1.20J/(g*K)-
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    surface resistivity1014O23°CDIN IEC 60093
    Dielectric constant3.59-1 kHz, 23°CDIN IEC 60250
    volume resistivity> 1014O*cm23°CDIN IEC 60093
  • Other properties
    Other propertiesValueUnitParameterNorm
    Water absorption0.53%24 h in water, 23°CDIN EN ISO 62
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;

Stock program