TECAPEEK CMP natural

PEEK for CMP applications

TECAPEEK CMP is a Victrex® PEEK polymer specially modified for applications in the semiconductor industry, and more specfically for parts in CMP (chemical mechanical planarization) equipment. The material maintains the outstanding property profile inherant to PEEK, which includes high mechanical strength and dimensional stability for tightest part tolerances, along with a low tendency to creep. TECAPEEK CMP is of a higher purity level than standard TECAPEEK. This combined with excellent chemical resistance and specially improved abrasion and friction characteristics, rounds out the property profile of this PEEK CMP modification.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
natural
Alternative colours available

Density
1,31 g/cm3

Main Features

  • good heat deflection temperature
  • good machinability
  • inherent flame retardant
  • hydrolysis and superheated steam resistant
  • high toughness
  • resistance against high energy radiation
  • good slide and wear properties
  • high creep resistance

Target industries

Technical details


  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Compression strength34MPa1% / 2%EN ISO 604
    Modulus of elasticity
    (flexural test)
    3900MPa2mm/min, 10 NDIN EN ISO 178
    Flexural strength160MPa2mm/min, 10 NDIN EN ISO 178
    Elongation at break50%50mm/minDIN EN ISO 527-2
    Tensile strength at yield110MPa50mm/minDIN EN ISO 527-2
    Elongation at yield4%50mm/minDIN EN ISO 527-2
    Modulus of elasticity
    (tensile test)
    4100MPa1mm/minDIN EN ISO 527-2
    Tensile strength110MPa50mm/minDIN EN ISO 527-2
    Ball indentation hardness240MPaISO 2039-1
    Impact strength (Charpy)n.b.kJ/m2max. 7,5JDIN EN ISO 179-1eU
    Compression modulus3200MPa5mm/min, 10 NEN ISO 604
    Notched impact strength (Izod)4kJ/m2DIN EN ISO 179-1eA
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Thermal expansion (CLTE)610-5*1/K23-100°C, long.DIN EN ISO 11359-1;2
    Thermal expansion (CLTE)510-5*1/K23-60°C, long.DIN EN ISO 11359-1;2
    Service temperature260Clong termNN
    Heat distortion temperature162CHDT, Method AISO-R 75 Method A
    Service temperature300Cshort termNN
    Melting temperature340CDIN EN ISO 11357
    Glass transition temperature151CDIN EN ISO 11357
    Thermal conductivity0.27W/(k*m)ISO 22007-4:2008
    Specific heat1.1J/(g*K)ISO 22007-4:2008
    Thermal expansion (CLTE)710-5*1/K100-150°C, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    surface resistivity1015OSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    volume resistivity1015O*cmSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    Dielectric strength73kV/mm23°C, 50% r.h.ISO 60243-1
    Resistance to tracking (CTI)125VPlatin electrode, 23°C, 50% r.h., solvent ADIN EN 60112
  • Other properties
    Other propertiesValueUnitParameterNorm
    Resistance to hot water/ bases+--
    Resistance to weathering---
    Water absorption0.03%24h / 96h (23°C)DIN EN ISO 62

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