Ceramic filled peek enhanced for micro machining

TECAPEEK CMF white is a composite material based on Victrex® PEEK 450G polymer which is filled with ceramic. This material has been specifically designed with the requirements of integrated circuit (IC) test sockets and electronic testing fixtures in mind. Because of intricate designs necessary for test sockets and fixtures, TECAPEEK CMF white has been designed with ceramic fillers to be very dimensionally stable and machinable with tightest tolerances. Ceramic filled PEEK resists the formation of burrs during machining and does not absorb moisture, allowing for accurate and precise geometries, without the necessity of secondary deburring operations. The right balance of stiffness and elongation allows machinability of micro holes smaller than 0,1 mm with high levels of hole position accuracy. Moreover, the elevated level of rigidity enables one to solve bending issues of contact plates with thin cross sections. The outstanding properties of PEEK natural such as excellent thermal resistance (up to 260 °C), low CLTE, low moisture absorption, and high strength are retained by TECAPEEK CMF white.

Compared to fibre-reinforced plastics, TECAPEEK CMF white provides less drill bit deflection, enabling significantly higher hole position accuracy. In addition, less drill bit wearing than fibre-reinforced plastics, enables longer drill bit lifetime, reducing machining costs.
Compared to injection molded plates, extruded TECAPEEK CMF white provides less residual stresses, enabling less warpage and bending during machining. Low internal stress and warpage is key for achieving the tight flatness tolerances, as the market is trending towards thinner cross sections of test socket contact plates. Moreover, lower internal stress enables faster speeds and feeds, resulting in faster part production and better yield, which reduces fabrication cost and time.
TECAPEEK CMF white is included in Ensinger's semiconductor grade portfolio, that is produced with stringent contamination controls and offering copy exact compliance. Therefore, Ensinger ensures the highest level of cleanliness and quality performance consistency of this unique property profile. The TECAPEEK CMF series is offered in white and grey  with the same property profile. With TECAPEEK SD black, Ensinger also offers an electrostatic dissipative version with comparable properties for enhanced micro machinability.

As with all Ensinger semiconductor grade materials, we can confirm that TECAPEEK CMF white meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.


Chemical designation
PEEK (Polyetheretherketone)
Alternative colours available
1.65 g/cm3

Main Features

  • good machinability
  • high dimensional stability
  • high strength
  • high stiffness
  • low thermal expansion
  • low burring
  • good heat deflection temperature
  • very good thermal stability

Target industries

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Modulus of elasticity
    (tensile test)
    5500 MPa 1mm/min DIN EN ISO 527-2
    Tensile strength 105 MPa 50mm/min DIN EN ISO 527-2
    Tensile strength at yield 102 MPa 50mm/min DIN EN ISO 527-2
    Elongation at yield (tensile test) 3 % 50mm/min DIN EN ISO 527-2
    Elongation at break (tensile test) 4 % 50mm/min DIN EN ISO 527-2
    Flexural strength 170 MPa 2mm/min, 10 N DIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    5500 MPa 2mm/min, 10 N DIN EN ISO 178
    Compression modulus 4300 MPa 5mm/min, 10 N EN ISO 604
    Compression strength 25/46/105 MPa 1% / 2% / 5% EN ISO 604
    Impact strength (Charpy) 65 kJ/m2 max. 7,5J DIN EN ISO 179-1eU
    Shore hardness 90 D DIN EN ISO 868
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 151 C DIN EN ISO 11357
    Melting temperature 339 C DIN EN ISO 11357
    Thermal conductivity 0.38 W/(k*m) ISO 22007-4:2008
    Specific heat 1.0 J/(g*K) ISO 22007-4:2008
    Service temperature 300 C short term NN
    Service temperature 260 C long term NN
    Thermal expansion (CLTE) 5 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 5 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 6 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1014 Silver electrode, 23°C, 12% r.h. -
    volume resistivity 1014 Ω*cm Silver electrode, 23°C, 12% r.h. -
    Dielectric strength 57 kV/mm 23°C, 50% r.h. ISO 60243-1
    Resistance to tracking (CTI) 175 V Platin electrode, 23°C, 50% r.h., solvent A DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Resistance to weathering - - -
    Water absorption 0.02 - 0.03 % 24h / 96h (23°C) DIN EN ISO 62
  • product-technical-detail-collapse-item-4-lvl-1
    Relative costs Value Unit Parameter Norm
    Relative costs EU from € to €€€€€€ €€€€€ % -

Stock program