Polyimides Plastic
Sintered and Direct Formed Plastics

Sintered plastics

PI material, (chemically known as Polyimides) is a non-melting high temperature polymer. In addition to the sintering process used to produce stock shapes, finished components can be cost-effectively produced in larger quantities using the direct forming process.  

PI plastics are used everywhere where very high or cryogenic temperature resistance is required. Even above 260 °C, dimensional stability, strength and creep resistance remain high. For wear and friction applications Polyimides are the ideal material due to the ability to work under unlubricated conditions, low wear rates and high pV-rates. Thus lifetimes are extended and maintenance costs reduced. 

Polyimide applications can therefore be found in a wide range of industries.For aerospace and semicon industry the high purity and low outgassing are additional benefits of Polyimide plastics.

Polyimides have exceptional properties for high performance applications

  • Long-term thermal stability 300 °C (short-term up to 400 °C)
  • High heat resistance up to 470 °C (HDT/A)
  • Good cryogenic properties down to -270 °C
  • High strength, modulus and stiffness also at high temperatures over 260 °C
  • Excellent wear resistance under high surface pressure and high sliding speeds
  • Excellent thermal and electrical insulation
  • Minimal thermal conductivity
  • High purity, low outgassing in vacuum conditions in accordance with ESA regulation ECSS-Q-70-02
  • Good machinability
  • Good chemical resistance to acids, fats and solvents
  • Inherently flame retardant  (UL 94 V0)

TECASINT Product Families

The materials belonging to the polyimide group are characterised by an unusually complex property profile with a large number of excellent individual characteristics and so take up a position at the tip of the material pyramid.

Ensinger offers rods, plastes and tubes as well as customized direct formed parts. Polyimides (PI) are produced by polycondensation.

They are non melting due to the high amount of ring-shaped, mostly aromatic chain links and high molecular weights.  The manufacturing of semi-finished products or direct-forming parts is therefore done exclusively by sintering techniques.


  • Very high modulus
  • High rigidity and hardness
  • Previous designation "SINTIMID"


  • Very high modulus
  • High rigidity
  • High hardness
  • Significantly reduced moisture absorption compared to TECASINT 1000
  • Higher toughness and improved machining capability
  • Ideally suited for direct forming components


  • Minimal water absorption
  • Highest stability against oxidation in air
  • Low friction and wear
  • Optimum chemical resistance
  • HDT /A up to 470 °C
  • Different types available with high elongation at break and toughness our with high flexural modulus


  • Cost-effective polyimide-types for the semiconductor industry
  • Extremely good dimensional stability
  • Load capacity up to 300 °C

TECASINT 6000 (Type for Direct Forming)

  • Very good long-term thermal and oxidative resistance
  • High modulus and strength over a wide temperature range
  • Very good sliding & friction properties in lubricated and non-lubricated environments
  • Excellent wear properties
  • High creep resistance
  • Low water absorption
  • Low outgassing in vacuum
  • Improved chemical resistance compared to conventional polyimides
  • Resistant to high energy radiation


  • Matrix of PTFE reinforced with PI powder
  • Reduced creep under load
  • Excellent sliding and friction properties
  • Ideally suited for soft sliding partners (stainless steel, aluminium, brass, bronze)
  • Best chemical resistance
  • Easy machining properties

Core industries for the use of Polyimides

Polyimides for automotive applications

Due to the TECASINT property profile, these materials are frequently superior to other plastics and metals. They can be used to implement applications involving the most extreme conditions, and are used for applications in the automotive industry requiring mechanical stability under high continuous temperatures or high pV values in lubricated and unlubricated environments. Use of the direct forming method allows the economical manufacture of serial parts complying with the narrowest of tolerances.

Polyimides for vacuum and cryogenic

Applications in vacuum and cryogenic technology require materials with good mechanical and tribological properties coupled with low outgassing values. Therefore, TECASINT 2391 is the ideal solution for these fields of application.

Polyimides for aerospace applications

Low outgassing rates, high purity and good mechanical properties are key requirements in the manufacture of satellites. Excellent tribological properties, a long service life and low wear are essential criteria for the production of bearing bushes used in modern aircraft engines. TECASINT is the ideal material to address all these 

Polyimides in the glass industry

The use of polyimides can enhance productivity in the manufacture of glass bottles for container glass, the pharmaceutical and cosmetics industry. Their excellent temperature resistance and low thermal conductivity lend these high-performance plastics key benefits, particularly for hot- glass handling, compared to components made of graphite. They also help extend the service life of components and reduce the reject rates. In addition, these materials are economical to process, making them an ever more popular alternative for the production of take-out tongs and bottle grippers.

Polyimides for mechanical engineering

Various applications in mechanical engineering require demanding mechanical and tribological properties at temperatures above 200 °C. TECASINT - grades meet these requirements due to their excellent properties.

Polyimides for semiconductor production

Alongside its excellent electrical insulation, TECASINT also offers a very low ion content, making it ideal for use in the semiconductor industry and in cleanroom environments, for example in test sockets or in chip and wafer manufacture.

Fields of applications

  • Tribological applications: Bearing parts, bushings, washers, piston rings and guiding elements
  • Hot glass handling parts for the glass industry
  • Space and aircraft applications
  • Semiconductor production equipment like IC testsockets
  • Radiation and chemical resistant sealings for valves
  • Vacuum equipment parts
  • Cryogenic parts down to -270 °C

Application examples

Sensor housing made of TECASINT 5011 (PAI)

  • Thermal resistance up to 300 °C
  • Very good electrical insulation

Bottle gripper made from high-temperature polyimide

Polyimides from the TECASINT product family are increasingly used for bottle grippers and transportation discs.  

  • Cost savings due to 3-4 times greater durability compared with conventional materials (such as CFC)
  • Excellent war resistance
  • Significant reduction of micro cracks
  • Low thermal conductivity, good impact resistance and high modulus of elasticity

Test socket made of TECASINT 4011 (PI)

  • Low outgassing 
  • No condensable impurities
  • High dimensional stability
  • Thermal resistance up to 300 °C
  • High strength
  • Good electrical insulation

High quality Rods, Plates and Tubes in various dimensions

Ensinger offers TECASINT polyimide stock shapes as pressed round rods, plates, short pipes and discs in a wide range of dimensions.

We keep a permanent stock of popularly used TECASINT materials, modifications and dimensions. We also manufacture dimensions specifically to customer requirements.  

Shapes on stock

  • Round rods from Ø 6 - 50 mm
    (length up to 1.000 mm)
  • Plate thickness from 6 - 50 mm
    (length up to  300 x 1.000 mm)
  • Short tubes

Shapes on request

Other diameters on request. Maximum thickness up to 100 mm, maximum rod diameter up to 100 mm (type dependant).


Direct forming is a cost effective manufacturing method for producing high volume precision parts. Direct formed Polyimide parts are typically used for applications in the automotive industry or for large quantity production, when machining shapes is too expensive. Fast running presses (mechanical or hydraulic) compact the powder in the mould cavity. The mouldings are then sintered for some hours at high tem­per­a­tures with the exclu­sion of oxygen. The direct forming technique in­volves practically no material waste. In most cases, reworking is also not required.

Machined Parts

Alongside the manufacture of stock shapes and direct forming parts, the TECASINT materials can be machined with ease. Complex, tight tolerance components can be produced on standard milling machines and turning lathes. For optimal results, specific plastic cutters should be used. TECASINT can be machined in a dry state or with coolant if necessary.

Case Study: TECASINT goes to mercury

Thermal spacer

made of TECASINT

With Bepi Colombo to Mercury

Ensingers TECASINT material is part of Europe's first mission to Mercury with BepiColombo. The spacecraft for the mission are dependent on the function of the thermal control system (TCS), which keeps all the spacecraft's component systems within an acceptable temperature range during every phase of the mission. One part of the TCS is a thermal spacer, which functions as a barrier to high temperatures and radiation. This thermal spacer is a ring shaped plate made of TECASINT.


We produce Polyimides in form of semi-finished products and finished parts. Further development of proven production techniques, new applications and international expansion have earned the family-owned Ensinger enterprise a place among the leaders in its field.

Contact us via our contact form, by email or by phone +43 7662 88788 401. 

Sintered Plastics: TECASINT Compendium

Parts and shapes made of TECASINT have excellent long term stability.

Sintered Plastics: TECASINT 4000 – High-performance for exceptional applications

TECASINT 4000 is characterized by its minimal water absorption and maximum oxidative stability, as well as low friction values and optimum chemical resistance.

Sintered plastics: TECASINT – Flame retardance / LOI

TECASINT parts are specified in high temperature applications and devices where inherent flame retardant plastics are required.

Sintered plastics: TECASINT Polyimides high performance plastics for the semiconductor industry

TECASINT - high temperature resistant and dimensional stable polyimides with defined electrical properties.

Sintered Plastics: TECASINT 6032 for the glass container industry

High temperature resistance and low thermal conductivity of polyimides offer great benefits when handling hot glass.

Sintered Plastics: TECASINT – Outstanding characteristics for aerospace applications

TECASINT offers high purity and low outgassing values in accordance with ESA-regulation.

Sintered plastics: TECASINT – Excellent vacuum & cryogenic properties

TECASINT materials are characterised by low service temperatures and combine the essential requirements under vacuum and cryogenic conditions.

Sintered Plastics: TECASINT 5000 – Cost-effective polyimide types for the semiconductor industry

TEACSINT 5000 is an amorphous high-temperature-Polyimide. Excellent dimensional stability and good wear resistance offer benefits for a broad range of applications.

Sintered plastics: TECASINT – Excellent oxygen compatibility

High-performance plastic for applications in gaseous oxygen

Sintered plastics: TECASINT – Low friction and less wear at high pv-values

TECASINT for high-performance tribological applications