TECAPEEK® ELS nano black

ELECTRICALLY CONDUCTIVE PEEK WITH CARBON NANO TUBE FILLER

For applications that require a plastic with the added characteristic of electrical conductivity, Ensinger has developed PEEK ELS under the trade name TECAPEEK ELS nano black, using Victrex® PEEK 450 polymer. This material takes advantage of the addition of carbon nano tubes, which allows for a high degree of conductivity to be achieved while maintaining low levels of filler content. As a result, TECAPEEK ELS nano provides consistent surface resistivity between 102 – 10 Ω/sq, while offering significantly reduced residual stresses compared to carbon fibre reinforced grades, enabling less warpage, and bending during machining. Enhanced dimensional stability is key for achieving the tight tolerances  required for semiconductor manufacturing equipment components. In addition, lower internal stress enables faster speeds and feeds, results in faster part production and better yield, which reduces fabrication costs. The outstanding properties of PEEK natural such as excellent thermal resistance (up to 260 °C), low CLTE, low moisture absorption, and high strength are retained by TECAPEEK ELS nano black.

TECAPEEK ELS nano black is included in Ensinger's semiconductor grade portfolio, thus, is produced with stringent contamination controls and offering copy exact compliance. Therefore, Ensinger ensures the highest level of quality performance consistency of this unique property profile. Moreover, the low level of ionic impurity content in the filler, as well as the low filler content, enables TECAPEEK ELS nano black to provide higher ionic purity compared to standard carbon fibre reinforced materials.
Thus, TECAPEEK ELS nano black is the perfect choice for semiconductor and electronics manufacturing equipment parts, requiring high dimensional stability and cleanliness, while protecting semiconductor devices from damaging electrostatic discharges (ESD). Throughout the various manufacturing stages, TECAPEEK ELS nano can reduce the risk of charging and subsequent ESD damages, contributing to yield, quality, and output improvements. 

For applications requiring a slower rate of decay of static charge in a controlled manner, Ensinger offers TECAPEEK SD black with a surface resistivity between 106 – 109 Ω/sq. For applications with temperatures not exceeding 100 °C and lower mechanical property requirements, Ensinger also offers a conductive POM-C grade under the tradename TECAFORM AH ELS black. 

As with all Ensinger semiconductor grade materials, we can confirm that TECAPEEK ELS nano black meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Color
black
Density
1.36 g/cm3

Main Features

  • high dimensional stability
  • high continuous use temperature
  • high strength
  • very good chemical resistance
  • electrically conductive
  • high thermal and mechanical capacity
  • good machinability
  • high toughness

Target industries

Downloads

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Tensile strength 15400 psi 2 in/min DIN EN ISO 527-2
    Tensile strength at yield 15400 psi 2 in/min DIN EN ISO 527-2
    Elongation at yield (tensile test) 4 % 2 in/min DIN EN ISO 527-2
    Elongation at break (tensile test) 4 % 2 in/min DIN EN ISO 527-2
    Flexural strength 25800 psi 0.078 in/min, 2.25 lbf DIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    682000 psi 0.078 in/min, 2.25 lbf DIN EN ISO 178
    Compression modulus 522000 MPa 0.197 in/min, 2.25 lbf EN ISO 604
    Impact strength (Charpy) 27.6 ft-lbs/in^2 DIN EN ISO 179-1eU
    Ball indentation hardness 36700 psi ISO 2039-1
    Modulus of elasticity
    (tensile test)
    696000 psi 0.039 in/min DIN EN ISO 527-2
    Compression strength 6820 psi 2% strain EN ISO 604
    Compression strength 15400 psi 5% strain EN ISO 604
    Compression strength 3920 psi 1% strain EN ISO 604
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Melting temperature 646 F DIN EN ISO 11357
    Glass transition temperature 297 F DIN EN ISO 11357
    Thermal conductivity 3.19 BTU-in/hr-ft^2 - deg ISO 22007-4:2008
    Specific heat 0.00026 butlbf ISO 22007-4:2008
    Service temperature 572 F short term -
    Thermal expansion (CLTE) 2.78 *10^-5 in/in / degre 73 - 140°F, long. DIN EN ISO 11359-1;2
    Service temperature 500 F long term -
    Thermal expansion (CLTE) 2.78 *10^-5 in/in / degre 73 - 212°F, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 3.89 *10^-5 in/in / degre 212 - 300°F, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    volume resistivity 103 - 105 Ω*cm Conductive rubber, 73°F, 12% r.h. DIN EN 61340-2-3
    surface resistivity 102 - 104 Conductive rubber, 73°F, 12% r.h. DIN EN 61340-2-3
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Resistance to hot water/ bases + - -
    Resistance to weathering (+) - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    HZ Aerospace Brochure yes - -
    HZ-Catalogue yes - -
    Water absorption 0.02 - 0.03 % 24h / 96h (73°F) DIN EN ISO 62
    Water absorption % saturation (23°C) DIN EN ISO 62

Stock program