Moulded Interconnect Devices (MID) integrate conductors and electrical circuits directly into three-dimensional plastic components which can be moulded practically at will. This makes the components both a housing and an electronic circuit in one. These injection moulded circuit carriers enable companies to develop components which are smaller, lighter and less expensive than is possible using classical circuit boards. Three dimensional MID systems are also simpler to mount and enable the integration of additional functions.
There can be hardly any other application which poses such widely differing demands on a compound than MID technology. LDS requires the compound to have high thermal resistance, good isotropic component behaviour and, most importantly, good capacity for metallization.
Dural and firmly fixed metal pathways due to new fillers
During the LDS process, polymers are bonded to metals. The difficulty here is that plastics fundamentally demonstrate much higher thermal expansion than metal. If components are exposed to alternating thermal stress, there is a considerable risk of the conductor becoming detached over time.
Low thermal expansion
Material developments are focused on the implementation of reduced conductor widths and improvement of thermal expansion and conduction. The choice of polymers is consequently restricted to highly thermally stable plastics. The matrix polymers used by Ensinger are polyphthalamides (PPA), polyetheretherketones (PEEK) and liquid crystal polymers (LCP). They have a dark greyish-black colour as standard, but thanks to the special filler concept from Ensinger it is also possible to produce very light-coloured LDS structures without a copper base.
High-tech plastics are characterized by their excellent dimensional stability and rigidity, even at extremely high temperatures. LCP also comes with good chemical and flame-retardant properties, and is the thermosetting plastic with the lowest thermal expansion. The use of fillers further reduces expansion.