Ensinger has developed specialised thermoplastic materials for three-dimensional electronic components (3D MID) which have been optimised for the LDS process. Molded Interconnect Devices (MID) integrate circuit traces and electrical circuitry directly into three-dimensional plastic components.
LDS technology primarily offers advantages when the installation space is limited, the number of components and process steps need to be reduced, and new design approaches are achievable.
The wealth of applications ranges from medical technology and the automotive industry to network systems and other wireless applications.
Scarcely any application places so many different demands on a compound as MID technology.
On the injection-moulded component, the laser activates the copper ions present in the material, and in the process draws the structure for the circuit trace. In the subsequent copper bath, the structure is coated e.g. with copper-nickel-gold.
LDS requires the compound to have high thermal stability, good isotropic component behaviour and above all be suitable for metallisation. HT materials are required above all for reflow soldering processes of passive elements.
In the LDS process, polymers are joined to metals. The difficulty here is that plastics essentially exhibit much higher thermal expansion than metals.
The TECACOMP LDS materials have a similar coefficient of expansion to copper, and good dielectric behaviour. Consequently they are ideal for replacing circuit boards.
With the TECACOMP LDS materials, a surface roughness and circuit trace edge definition can be achieved that enable a fine pitch design of up to 75µ.
Ensinger is the only plastics processor worldwide able to offer a PEEK for the LDS method that has been certified by LPKF Laser & Electronics AG. The high-performance polymer stands out for its high thermal stability up to 300 degrees Celsius. It also has very good weld line strength, good adhesive strength and good chemical resistance. Plated through hole bonding is possible. Important applications for the material TECACOMP PEEK LDS are aerials, sensors and safety applications.
TECACOMP LCP LDS is particularly suitable for very thin-walled components. The liquid crystalline material LCP stands out for very good dimensional stability and rigidity. Furthermore, the plastic has good chemical and flame-retardant properties. Target industries are electrical engineering and LED light technology, mechanical engineering and the automotive sector.
The LDS portfolio is completed by TECACOMP PPA LDS which is easy to process and has thermal stability up to 250 degrees Celsius.
TECACOMP LDS sample for application
Smart phone antennea
Suitable for all popularly used soldering techniques up to 260°C
