TECASINT 4011 natural

unfilled polyimide

Compared with the other TECASINT materials, the TECASINT 4000 series exhibits very low moisture absorption and high oxidative stability along with improved chemical resistance. Despite its high strength, TECASINT 4011 natural has high elongation at break and toughness. Rigidity and modulus are significantly increased in relation to conventional polyimides in a temperature range up to 260 °C. It also provides high thermal and electrical insulation. In addition, this polyimide plastic offers high purity and displays low outgassing in accordance with ESA regulation ECSS-Q-70-20.

TECASINT 4011 natural is included in Ensinger's semiconductor grade portfolio, that is produced with stringent contamination controls, and offering copy-exact compliance. As a result, Ensinger ensures the highest level of cleanliness and quality performance consistency of this unique property profile. TECASINT 4011 natural is often used in IC test sockets and electronic fixtures due to its excellent dimensional stability and micro machinability of tight tolerances.

The unique balance of stiffness and ductility allows for very low levels of burr formation, deformation, and cracking during machining of microstructures, enabling one to considerably reduce fabrication costs compared to industry standard test socket materials. This polyimide material is also often used in semiconductor manufacturing equipment parts such as in plasma etching vacuum chambers due to its very low level of outgassing and high temperature resistance.

As with all Ensinger semiconductor grade materials, we can confirm that TECASINT 4011 natural meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.


Chemical designation
PI (Polyimide)
1.42 g/cm3

Main Features

  • very high thermal and oxidative resistance
  • very low water absorption
  • high thermal and mechanical capacity
  • high creep resistance
  • low outgassing
  • good chemical resistance
  • resistance against high energy radiation
  • sensitive to hydrolysis in higher thermal range

Target industries


Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Notched impact strength (Charpy) 9.6 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Impact strength (Charpy) 87 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Shore hardness 88 Shore D DIN EN ISO 868
    Tensile strength 134 MPa 0.40 inch/min ASTM D 638
    Modulus of elasticity
    (tensile test)
    4083 MPa 0.04 inch/min ASTM D 638
    Flexural strength 207 MPa 0.54 inch/min ASTM D 790
    Ball indentation hardness 265 MPa ISO 2039-1
    Elongation at break (tensile test) 6.9 % 0.40 inch/min ASTM D 638
    Modulus of elasticity
    (flexural test)
    4299 MPa 0.54 inch/min ASTM D 790
    Compression modulus 4325 MPa 0.05 inch/min ASTM D 695
    Compression strength 188 MPa 0.05 inch/min, 10% strain ASTM D 695
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Glass transition temperature 500 F DIN EN ISO 11357
    Heat distortion temperature 680 F 1.82 MPa ASTM D 648
    Specific heat 1.22 J/(g*K) ASTM E1461
    Thermal conductivity 0.4 W/(k*m) 104°F ASTM E1461
    Thermal expansion (CLTE) 46 - 56 106*K-1 122-392°F DIN 53 752
    Thermal expansion (CLTE) 62 - 76 106*K-1 392-572°F DIN 53 752
    Thermal expansion (CLTE) 85 - 112 106*K-1 572-662°F DIN 53 752
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1016 73°F ASTM D 257
    volume resistivity 1016 Ω*cm 73°F ASTM D 257
    Electric strength DC 18 kV*mm-1 73°F ASTM D 149
    Dielectric loss factor 1*10-3 1 kHz ASTM D 150
    Dielectric constant 3.59 1 kHz ASTM D 150
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    HZ-Catalogue yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    Water absorption 0.02 - 0.06 % 24h / 96h (23°C) DIN EN ISO 62
    Outgassing in high vacuum passed ECSS-Q-70-02
    Water absorption 0.16 % 24 h in water, 73°F DIN EN ISO 62
    Water absorption 0.6 % 24 h in water, 176°F DIN EN ISO 62
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Oxygen Index 49 % EN ISO 4589-2

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