TECATRON SX natural

Modified PPS for the semiconductor industry

This modified Polyphenylensulfide, or PPS plastic, is a high performance plastic which has been especially developed for applications in the semiconductor industry. Particularly the combination of excellent wear and sliding properties makes this PPS material suitable for CMP (Chemical Mechanical Planarization) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic.

Facts

Chemical designation

PPS (Polyphenylensulfide)

Color

beige

Density

1,36 g/cm3

Main Features

good heat deflection temperature
good chemical resistance
resistance against high energy radiation
high strength
high dimensional stability
high stiffness
high creep resistance

Target industries

semiconductor technology

Downloads

Datasheet (PDF)

Technical details

Mechanical properties

Mechanical properties
Mechanical properties	Value	Unit	Condition	Test Method
Modulus of elasticity (tensile test)	597,800	psi	@ 73 °F	ASTM D 638
Compression modulus	429,400	psi	@ 73 °F	ASTM D 695
Impact strength (Izod)	0.58	ftlbsin	@ 73 °F	ASTM D 256
Compression strength	4,376	psi	1% strain	ASTM D 695
Elongation at yield	3.7	%	@ 73 °F	ASTM D 638
Tensile strength at yield	15,120	psi	@ 73 °F	ASTM D 638
Tensile strength	14,200	psi	@ 73 °F	ASTM D 638
Flexural strength	22,400	psi	@ 73 °F	ASTM D 790
Elongation at break	4.98	%	@ 73 °F	ASTM D 638
Modulus of elasticity (flexural test)	596,800	psi	@ 73 °F	ASTM D 790
Rockwell hardness	103.9	-	M scale	ISO 2039-1
Compression strength	20,560	psi	10% strain	ASTM D 695
Shore hardness	85.2	-	D scale	ASTM D 2240

Thermal properties

Thermal properties
Thermal properties	Value	Unit	Condition	Test Method
Thermal expansion (CLTE)	3.89	*10^-5 in/in / degre	73-212 °F, long.	DIN EN ISO 11359-1;2
Service temperature	446	F	long term	-
Glass transition temperature	341	F		-
Thermal expansion (CLTE)	3.33	*10^-5 in/in / degre	73-140 °F, long.	DIN EN ISO 11359-1;2
Service temperature	500	F	short term	-
Melting temperature	543	F		-
Thermal conductivity	1.74	BTU-in/hr-ft^2 - deg		ISO 22007-4:2008
Specific heat	0.239	butlbf		ISO 22007-4:2008
Thermal expansion (CLTE)	6.67	*10^-5 in/in / degre	212-302 °F, long.	DIN EN ISO 11359-1;2

Electrical properties
Electrical properties
Electrical properties Value Unit Condition Test Method
volume resistivity 10¹⁴ O*cm DIN IEC 60093
surface resistivity 10¹⁴ O DIN IEC 60093

Electrical properties
Electrical properties	Value	Unit	Condition	Test Method
volume resistivity	10¹⁴	O*cm		DIN IEC 60093
surface resistivity	10¹⁴	O		DIN IEC 60093

Other properties

Other properties
Other properties	Value	Unit	Condition	Test Method
HZ-Catalogue	no	-		-
HZ Semicon brochure	yes	-		-
Water absorption	0.01	%	24 hr immersion	ASTM D 570
Resistance to hot water/ bases	+	-		-
Flammability (UL94)	V0	-	corresponding to	DIN IEC 60695-11-10;
Resistance to weathering	-	-		-