TECATRON SX natural

Modified PPS for the semiconductor industry

This modified Polyphenylensulfide, or PPS plastic, is a high performance plastic which has been especially developed for applications in the semiconductor industry. Particularly the combination of excellent wear and sliding properties makes this PPS material suitable for CMP (Chemical Mechanical Planarization) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic.

Facts

Chemical designation
PPS (Polyphenylensulfide)
Color
beige
Density
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Modulus of elasticity
    (tensile test)
    597,800 psi @ 73 °F ASTM D 638
    Compression modulus 429,400 psi @ 73 °F ASTM D 695
    Impact strength (Izod) 0.58 ftlbsin @ 73 °F ASTM D 256
    Compression strength 4,376 psi 1% strain ASTM D 695
    Elongation at yield (tensile test) 3.7 % @ 73 °F ASTM D 638
    Tensile strength at yield 15,120 psi @ 73 °F ASTM D 638
    Tensile strength 14,200 psi @ 73 °F ASTM D 638
    Flexural strength 22,400 psi @ 73 °F ASTM D 790
    Elongation at break (tensile test) 4.98 % @ 73 °F ASTM D 638
    Modulus of elasticity
    (flexural test)
    596,800 psi @ 73 °F ASTM D 790
    Rockwell hardness 103.9 - M scale ISO 2039-1
    Compression strength 20,560 psi 10% strain ASTM D 695
    Shore hardness 85.2 - D scale ASTM D 2240
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Thermal expansion (CLTE) 3.89 *10^-5 in/in / degre 73-212 °F, long. DIN EN ISO 11359-1;2
    Service temperature 446 F long term -
    Glass transition temperature 341 F -
    Thermal expansion (CLTE) 3.33 *10^-5 in/in / degre 73-140 °F, long. DIN EN ISO 11359-1;2
    Service temperature 500 F short term -
    Melting temperature 543 F -
    Thermal conductivity 1.74 BTU-in/hr-ft^2 - deg ISO 22007-4:2008
    Specific heat 0.239 butlbf ISO 22007-4:2008
    Thermal expansion (CLTE) 6.67 *10^-5 in/in / degre 212-302 °F, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    volume resistivity 1014 O*cm DIN IEC 60093
    surface resistivity 1014 O DIN IEC 60093
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    HZ-Catalogue no - -
    HZ Semicon brochure yes - -
    Water absorption 0.01 % 24 hr immersion ASTM D 570
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Resistance to weathering - - -

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