Modified PPS for the semiconductor industry

This modified Polyphenylensulfide, or PPS plastic, is a high performance plastic which has been especially developed for applications in the semiconductor industry. Particularly the combination of excellent wear and sliding properties makes this PPS material suitable for CMP (Chemical Mechanical Planarization) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic.


Chemical designation
PPS (Polyphenylensulfide)
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitConditionTest Method
    Modulus of elasticity
    (tensile test)
    597,800psi@ 73 °FASTM D 638
    Compression modulus429,400psi@ 73 °FASTM D 695
    Impact strength (Izod)0.58ftlbsin@ 73 °FASTM D 256
    Compression strength4,376psi1% strainASTM D 695
    Elongation at yield3.7%@ 73 °FASTM D 638
    Tensile strength at yield15,120psi@ 73 °FASTM D 638
    Tensile strength14,200psi@ 73 °FASTM D 638
    Flexural strength22,400psi@ 73 °FASTM D 790
    Elongation at break4.98%@ 73 °FASTM D 638
    Modulus of elasticity
    (flexural test)
    596,800psi@ 73 °FASTM D 790
    Rockwell hardness103.9-M scaleISO 2039-1
    Compression strength20,560psi10% strainASTM D 695
    Shore hardness85.2-D scaleASTM D 2240
  • Thermal properties
    Thermal propertiesValueUnitConditionTest Method
    Thermal expansion (CLTE)3.89*10^-5 in/in / degre73-212 °F, long.DIN EN ISO 11359-1;2
    Service temperature446Flong term-
    Glass transition temperature341F-
    Thermal expansion (CLTE)3.33*10^-5 in/in / degre73-140 °F, long.DIN EN ISO 11359-1;2
    Service temperature500Fshort term-
    Melting temperature543F-
    Thermal conductivity1.74BTU-in/hr-ft^2 - degISO 22007-4:2008
    Specific heat0.239butlbfISO 22007-4:2008
    Thermal expansion (CLTE)6.67*10^-5 in/in / degre212-302 °F, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitConditionTest Method
    volume resistivity1014O*cmDIN IEC 60093
    surface resistivity1014ODIN IEC 60093
  • Other properties
    Other propertiesValueUnitConditionTest Method
    HZ Semicon brochureyes--
    Water absorption0.01%24 hr immersionASTM D 570
    Resistance to hot water/ bases+--
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;
    Resistance to weathering---

Stock program