TECASINT 5051 grey-green

with 30 % glass fibre

Starting with the unfilled base polymer TECASINT 5111, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 330°C, while the maximum service temperature may be – for a short time – up to 300 °C.


dark brown
1,56 g/cm3

Main Features

  • high thermal and mechanical capacity
  • very good electrical insulation
  • good wear properties
  • low thermal expansion
  • resistance against high energy radiation
  • high creep resistance
  • good chemical resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Impact strength (Charpy)20kJ/m2max 7.5 J, 23°CDIN EN ISO 179-1
    Shore hardness92-Shore D, 23°C-
    Tensile strength110MPa50 mm/min, 23°CDIN EN ISO 527-1
    Elongation at break (tensile test)2.2%50 mm/min, 23°CDIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    6500MPa1 mm/min, 23°CDIN EN ISO 527-1
    Flexural strength162MPa10 mm/min, 23°CDIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    6600MPa2 mm/min, 23°CDIN EN ISO 178
    Compression strength260MPa10 mm/min, 23°CEN ISO 604
    Compression modulus3000MPa1 mm/min, 23°CEN ISO 604
    Elongation at break (tensile test)2.6%10 mm/min, 23°CDIN EN ISO 178
    Compressive strain at break20%10 mm/min, 23°CEN ISO 604
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Glass transition temperature330C-
    Service temperature300Cshort-term-
    Thermal expansion (CLTE)-10-5*1/K50-200°CDIN EN ISO 11359-1;2
    Thermal expansion (CLTE)-10-5*1/K23-100°CDIN EN ISO 11359-1;2
    Thermal expansion (CLTE)-10-5*1/K100-150°CDIN EN ISO 11359-1;2
    Thermal conductivityW/(k*m)40°CDIN EN 821
    Specific heatJ/(g*K)DIN EN 821
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    Dielectric constant3.0-50 Hz, 23 °CDIN 53483-1
    surface resistivity1014O23°CDIN EN 61340-2-3
    Dielectric constant2.9-1 kHz, 23°CDIN 53483-1
    volume resistivity> 1014O*cm23°CDIN EN 61340-2-3
    Dielectric constant2.9-1 MHz, 23 °CDIN 53483-1
    Dielectric loss factor3.2*10-2-50 Hz, 23 °CDIN 53483-1
    Electric strength DC24kV*mm-1ISO 60243-1
    Dielectric loss factor2.2*10-3-1 kHz, 23°CDIN 53483-1
    Dielectric loss factor1.1*10-2-1 MHz, 23 °CDIN 53483-1
  • Other properties
    Other propertiesValueUnitParameterNorm
    Water absorption0.48%24 h in water, 23°CDIN EN ISO 62
    Water absorption1.66%24 h in water, 80°CDIN EN ISO 62
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;
    HZ Technical guidelinesyeslbs/in^2-
    HZ Semicon brochureyes--
    Water absorption%24h (23°C)DIN EN ISO 62

Stock program