Ceramic filled PEEK

TECAPEEK CMF is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirments of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as test sockets, TECAPEEK CMF has been designed with ceramic fillers to be very dimensionally stable and machinable with tightest tolerances. Ceramic filled PEEK resists the formation of burrs during machining and does not absorb moisture, allowing for more accurate and precise dimensions of even the smallest geometries, without the necessity of secondary de-burring operations. The characteristic profile of this ceramic filled PEEK is unique. Besides providing outstanding hardness and rigidity, the silicate ceramic within the plastic material also provides an effective barrier against gas and fluid permeation. The ceramic platelets distributed evenly in the material extend the diffusion path for fluids and gases. The outstanding properties of PEEK natural such as excellent thermal resistance and good processing properties are retained by TECAPEEK CMF. TECAPEEK CMF with ceramic filler is offered in white or grey pigment to allow for a choice if color is part of the design criteria.


Chemical designation
PEEK (Polyetheretherketone)
Alternative colours available
1,65 g/cm3

Main Features

  • good machinability
  • high dimensional stability
  • high strength
  • high stiffness
  • low thermal expansion
  • low burring
  • good heat deflection temperature
  • very good thermal stability

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Tensile strength105MPa50mm/minDIN EN ISO 527-2
    Tensile strength at yield102MPa50mm/minDIN EN ISO 527-2
    Elongation at yield3%50mm/minDIN EN ISO 527-2
    Elongation at break (tensile test)4%50mm/minDIN EN ISO 527-2
    Flexural strength170MPa2mm/min, 10 NDIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    5500MPa2mm/min, 10 NDIN EN ISO 178
    Compression strength25/46/105MPa1% / 2% / 5%EN ISO 604
    Compression modulus4300MPa5mm/min, 10 NEN ISO 604
    Impact strength (Charpy)65kJ/m2max. 7,5JDIN EN ISO 179-1eU
    Ball indentation hardness286MPaISO 2039-1
    Modulus of elasticity
    (tensile test)
    5500MPa1mm/minDIN EN ISO 527-2
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Melting temperature339CDIN EN ISO 11357
    Service temperature300Cshort termNN
    Service temperature260Clong termNN
    Thermal expansion (CLTE)510-5*1/K23-60°C, long.DIN EN ISO 11359-1;2
    Thermal expansion (CLTE)510-5*1/K23-100°C, long.DIN EN ISO 11359-1;2
    Glass transition temperature151CDIN EN ISO 11357
    Thermal conductivity0.38W/(k*m)ISO 22007-4:2008
    Specific heat1.0J/(g*K)ISO 22007-4:2008
    Thermal expansion (CLTE)610-5*1/K100-150°C, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    volume resistivity1014O*cmSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    Dielectric strength57kV/mm23°C, 50% r.h.ISO 60243-1
    surface resistivity1014OSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    Resistance to tracking (CTI)175VPlatin electrode, 23°C, 50% r.h., solvent ADIN EN 60112
  • Other properties
    Other propertiesValueUnitParameterNorm
    Resistance to hot water/ bases+--
    Resistance to weathering---
    Water absorption0.03%24h / 96h (23°C)DIN EN ISO 62
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;

Stock program