TECATRON SX natural

Modified PPS for the semiconductor industry

This modified Polyphenylensulfide, or PPS plastic, is a high performance plastic which has been especially developed for applications in the semiconductor industry. Particularly the combination of excellent wear and sliding properties makes this PPS material suitable for CMP (Chemical Mechanical Planarization) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic. Due to its high degree of ionic cleanliness TECATRON SX natural PPS is the material of choice for applications in the semiconductor industries, for example when processing wafers.

Facts

Chemical designation
PPS (Polyphenylensulfide)
Colour
beige
Density
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Modulus of elasticity
    (tensile test)
    4000 MPa 1mm/min DIN EN ISO 527-2
    Compression modulus 3300 MPa 5mm/min, 10 N EN ISO 604
    Impact strength (Charpy) 56 kJ/m2 max. 7.5J DIN EN ISO 179-1eU
    Compression strength 38 MPa 1% / 2% EN ISO 604
    Tensile strength at yield 100 MPa 50mm/min DIN EN ISO 527-2
    Tensile strength 102 MPa 50mm/min DIN EN ISO 527-2
    Flexural strength 151 MPa 2mm/min, 10 N DIN EN ISO 178
    Elongation at break (tensile test) 11 % 50mm/min DIN EN ISO 527-2
    Modulus of elasticity
    (flexural test)
    4000 MPa 2mm/min, 10 N DIN EN ISO 178
    Ball indentation hardness 230 MPa ISO 2039-1
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Thermal expansion (CLTE) 7 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Service temperature 230 C long term -
    Glass transition temperature 97 C DIN EN ISO 11357
    Thermal expansion (CLTE) 6 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Service temperature 260 C short term NN
    Melting temperature 281 C DIN EN ISO 11357
    Thermal conductivity 0.25 W/(k*m) ISO 22007-4:2008
    Specific heat 1.0 J/(g*K) ISO 22007-4:2008
    Thermal expansion (CLTE) 12 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    volume resistivity 1014 O*cm DIN IEC 60093
    surface resistivity 1014 O DIN IEC 60093
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    HZ-Catalogue no - -
    HZ Semicon brochure yes - -
    Water absorption 0.01 % 24h / 96h (23°C) DIN EN ISO 62
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Resistance to weathering - - -

Stock program