TECASINT 4111 natural

unfilled polyimide

Compared with the other TECASINT materials the TECASINT 4100 series exhibits extremely high thermal stability, extremely low moisture absorption and high mechanical rigidity. This is accompanied by a very high oxidative stability and increased resistance to chemicals. TECASINT 4111 natural has a very high thermal stability (HDT/A=470 °C). Rigidity and modulus are significantly increased in relation to conventional polyimides in a temperature range up to 400 °C. This polyimide material also provides high thermal and electrical insulation and offers high purity with low outgassing in accordance with ESA regulation ECSS-Q-70-02.

TECASINT 4111 natural is included in Ensinger's semiconductor grade portfolio, that is produced with stringent contamination controls, and offering copy-exact compliance. Thus, Ensinger ensures the highest level of cleanliness and quality performance consistency of this unique property profile. TECASINT 4111 natural is often used in IC test sockets and electronic fixtures due to its excellent dimensional stability and micro machinability of tight tolerances.

The high level of stiffness with flexural modulus up to 6100 MPa and elongation down to 1,7 % achieved without reinforcing fillers allows for optimum bending resistance, minimum burr formation, and highest machining accuracy. Offering the lowest level of water absorption among different polyimide grades and very low CLTE compared to industry standard test socket materials, TECASINT 4111 natural can maintain high levels of dimensional stability during machining and after prolonged use. This PI plastic is also often used in semiconductor manufacturing equipment parts such as in plasma etching vacuum chambers due to its very low level of outgassing, superior plasma resistance, and temperature resistance.

As with all Ensinger semiconductor grade materials, we can confirm that TECASINT 4111 natural meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.



Chemical designation
PI (Polyimide)
1.47 g/cm3

Main Features

  • very high thermal and oxidative resistance
  • very low water absorption
  • high thermal and mechanical capacity
  • low outgassing
  • good chemical resistance
  • high creep resistance
  • resistance against high energy radiation
  • sensitive to hydrolysis in higher thermal range

Target industries


Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Notched impact strength (Charpy) 1.1 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Impact strength (Charpy) 20 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Shore hardness 90 Shore D DIN EN ISO 868
    Tensile strength 100 MPa 50 mm/min DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    6100 MPa 1 mm/min DIN EN ISO 527-1
    Flexural strength 160 MPa 10 mm/min DIN EN ISO 178
    Compression strength 250 MPa 10 mm/min EN ISO 604
    Compression modulus 6193 MPa 1 mm/min EN ISO 604
    Ball indentation hardness 345 MPa -
    Compression 15 % -
    Elongation at break (tensile test) 1.7 % 50 mm/min DIN EN ISO 527-1
    Modulus of elasticity
    (flexural test)
    6100 MPa 2 mm/min DIN EN ISO 178
    Compressive strain at break 25 % 10 mm/min EN ISO 604
    Elongation at break (flexural test) 2.5 % 10 mm/min DIN EN ISO 178
    Compression strength 210 MPa 10 mm/min, 10% strain EN ISO 604
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature n.a. C DIN EN ISO 11357
    Heat distortion temperature 470 C 1.82 MPa ASTM D 648
    Thermal conductivity 0.52 W/(k*m) 40°C ASTM E1461
    Specific heat 1.24 J/(g*K) ASTM E1461
    Service temperature 450 C short term -
    Thermal expansion (CLTE) 4.7 - 6.9 10-5*1/K 200-300°C DIN 53 752
    Service temperature 294 C long term -
    Thermal expansion (CLTE) 3.6 - 5.2 10-5*1/K 50-200°C DIN 53 752
    Thermal expansion (CLTE) 6.5 - 9.9 10-5*1/K 300-400°C DIN 53 752
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1016 23°C ASTM D 257
    volume resistivity 1016 Ω*cm 23°C ASTM D 257
    Electric strength DC 22.7 kV*mm-1 23°C ASTM D 149
    Dielectric loss factor 0.0013 1 MHz ASTM D 150
    Dielectric constant 3.7 1 MHz ASTM D 150
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Outgassing in high vacuum passed ECSS-Q-70-02
    Water absorption 0.08 % 24 h in water, 23°C DIN EN ISO 62
    Water absorption 0.3 % 24 h in water, 80°C DIN EN ISO 62
    Oxygen Index 53 % EN ISO 4589-2

Stock program