Modified PPS for the semiconductor industry

This modified Polyphenylensulfide, or PPS plastic, is a high performance plastic which has been especially developed for applications in the semiconductor industry. Particularly the combination of excellent wear and sliding properties makes this PPS material suitable for CMP (Chemical Mechanical Planarization) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic. Due to its high degree of ionic cleanliness TECATRON SX natural PPS is the material of choice for applications in the semiconductor industries, for example when processing wafers.


Chemical designation
PPS (Polyphenylensulfide)
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Modulus of elasticity
    (tensile test)
    4000MPa1mm/minDIN EN ISO 527-2
    Compression modulus3300MPa5mm/min, 10 NEN ISO 604
    Impact strength (Charpy)56kJ/m2max. 7.5JDIN EN ISO 179-1eU
    Compression strength38MPa1% / 2%EN ISO 604
    Tensile strength at yield100MPa50mm/minDIN EN ISO 527-2
    Tensile strength102MPa50mm/minDIN EN ISO 527-2
    Flexural strength151MPa2mm/min, 10 NDIN EN ISO 178
    Elongation at break11%50mm/minDIN EN ISO 527-2
    Modulus of elasticity
    (flexural test)
    4000MPa2mm/min, 10 NDIN EN ISO 178
    Ball indentation hardness230MPaISO 2039-1
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Thermal expansion (CLTE)710-5*1/K23-100°C, long.DIN EN ISO 11359-1;2
    Service temperature230Clong term-
    Glass transition temperature97CDIN EN ISO 11357
    Thermal expansion (CLTE)610-5*1/K23-60°C, long.DIN EN ISO 11359-1;2
    Service temperature260Cshort termNN
    Melting temperature281CDIN EN ISO 11357
    Thermal conductivity0.25W/(k*m)ISO 22007-4:2008
    Specific heat1.0J/(g*K)ISO 22007-4:2008
    Thermal expansion (CLTE)1210-5*1/K100-150°C, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    volume resistivity1014O*cmDIN IEC 60093
    surface resistivity1014ODIN IEC 60093
  • Other properties
    Other propertiesValueUnitParameterNorm
    HZ Semicon brochureyes--
    Water absorption0.01%24h / 96h (23°C)DIN EN ISO 62
    Resistance to hot water/ bases+--
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;
    Resistance to weathering---

Stock program