PPS modified for semiconductor industry

This polyphenylensulfide (PPS) is a high performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties, and is manufactured by Ensinger under the tradename TECATRON SE. Its low ionic impurities make it an excellent choice for applications where high purity is a concern such as Semiconductor CMP (Chemical Mechanical Planarization) applications. Very high creep resistance, and low abrasion characteristics round out the profile of this PPS modification, allowing long term property retention.


Chemical designation
PPS (Polyphenylensulfide)
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Modulus of elasticity
    (tensile test)
    4100MPa1mm/minDIN EN ISO 527-2
    Compression modulus3300MPa5mm/min, 10 NEN ISO 604
    Impact strength (Charpy)29kJ/m2max. 7,5JDIN EN ISO 179-1eU
    Compression strength20/38/96MPa1% / 2% / 5%EN ISO 604
    Elongation at yield4%50mm/minDIN EN ISO 527-2
    Tensile strength at yield100MPa50mm/minDIN EN ISO 527-2
    Tensile strength102MPa50mm/minDIN EN ISO 527-2
    Flexural strength151MPa2mm/min, 10 NDIN EN ISO 178
    Elongation at break (tensile test)4%50mm/minDIN EN ISO 527-2
    Modulus of elasticity
    (flexural test)
    4000MPa2mm/min, 10 NDIN EN ISO 178
    Ball indentation hardness248MPaISO 2039-1
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Thermal expansion (CLTE)710-5*1/K23-100°C, long.DIN EN ISO 11359-1;2
    Service temperature230Clong term-
    Glass transition temperature97CDIN EN ISO 11357
    Thermal expansion (CLTE)610-5*1/K23-60°C, long.DIN EN ISO 11359-1;2
    Service temperature260Cshort termNN
    Melting temperature281CDIN EN ISO 11357
    Thermal conductivity0.25W/(k*m)ISO 22007-4:2008
    Specific heat1.0J/(g*K)ISO 22007-4:2008
    Thermal expansion (CLTE)1210-5*1/K100-150°C, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    volume resistivity1014O*cmDIN IEC 60093
    surface resistivity1014ODIN IEC 60093
  • Other properties
    Other propertiesValueUnitParameterNorm
    Water absorption0.01%24h / 96h (23°C)DIN EN ISO 62
    Resistance to hot water/ bases+--
    Flammability (UL94)V0-corresponding toDIN IEC 60695-11-10;
    Resistance to weathering---

Stock program