shielding plastic compounds

Shielding compounds - TECACOMP® EMI 

Modern technologies call for new electronic concepts. The requirements imposed by the auto­motive industry are a major driver in the trend towards smaller, lighter devices. Faultlessly operating driver assistance systems and the need to handle „big data“, for instance, are key requirements to the achievement of automated – and in the future driverless – travel.

The electronics industry in a state of flux

Performance densities and frequencies are increasing, electronic components need to trigger the right actions even with low signal currents. The emission of electromagnetic waves gives rise to the risk of interference with other electronic components. Conversely, it is also possible that the function of a device will itself be impaired by interference emissions from other emitters.

TECACOMP EMI shielding for the prevention of dips in shield atttenuation

shielding influencing factors

The problem of dips in shield attenuation can be countered with a suit­able component layout, by using metal and metal-­coated plastic housings and plastics com­pounded to be electrically conductive. At high frequencies in particular, these ­approaches will produce multiple reflections (room reson­ances). These will result in notches in shield­ing attenuation at different frequency points. The result: reduced operational safety, as an HF wave can be coupled into other com­ponents. 
By integrating suitable fillers into Ensinger EMI compounds, room resonances can be smoothed and consequently dips in attenu­ation can be decisively reduced. This has meant that users benefit from a new type of housing material which minimizes the drawbacks of existing EMC plastics and allows the overall configuration to more easily pass CE testing – even at higher frequencies.