TECATRON SE natural

PPS modified for semiconductor industry

This polyphenylensulfide (PPS) is a high performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties, and is manufactured by Ensinger under the tradename TECATRON SE. Its low ionic impurities make it an excellent choice for applications where high purity is a concern such as Semiconductor CMP (Chemical Mechanical Planarization) applications. Very high creep resistance, and low abrasion characteristics round out the profile of this PPS modification, allowing long term property retention.

Facts

Chemical designation
PPS (Polyphenylensulfide)
Color
beige
Density
1,36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Modulus of elasticity
    (tensile test)
    673,400 psi @73°F ASTM D 638
    Compression modulus 484,200 psi ASTM D 695
    Impact strength (Izod) 0.55 ftlbsin @73°F ASTM D 256
    Compression strength 19,960 psi @ 1% strain ASTM D 695
    Tensile strength at break 13,920 psi @73°F ASTM D 638
    Tensile strength 13,980 psi @73°F ASTM D 638
    Flexural strength 22,040 psi @73°F ASTM D 790
    Elongation at break (tensile test) 4.2 % @73°F ASTM D 638
    Modulus of elasticity
    (flexural test)
    636,000 psi @73°F ASTM D 790
    Rockwell hardness 103.3 - M scale ASTM D 785
    Compression strength 5,500 psi @ 10% strain ASTM D 695
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Service temperature 446 F long term -
    Glass transition temperature 194 F DIN EN ISO 11357
    Service temperature 500 F short term -
    Melting temperature 536 F DIN EN ISO 11357
    Thermal expansion (CLTE) 2.8 *10^-5 in/in / degre ASTM E 831
    Deflection temperature 239 F @ 264 psi ISO-R 75 Method A
    Deflection temperature 320 F @ 65 psi ISO-R 75 Method B
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    Dielectric constant 2.8 - @ 1 kHz DIN IEC 60250
    Dielectric constant 4.6 - @ 1 MHz DIN IEC 60250
    Dissipation factor 0.0011 - @ 1 MHz DIN IEC 60250
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    HZ-Catalogue no - -
    HZ Semicon brochure yes - -
    Water absorption 0.02 % @ 24 hrs ASTM D 570
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - @ 3 mm -
    Resistance to weathering - - -

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