TECAPEEK SE natural

PEEK for Semicon applications

TECAPEEK SE is a Victrex® PEEK polymer modified for Semiconductor industry applications. Due to its low ionic impurities, this material is well suited to applications where high purity is of great concern, such as are found in semiconductor or CMP applications. High dimensional stability and excellent chemical, abrasion and wear resistance, make it an excellent choice for parts with tight tolerances or that require long wear life in harsh environments.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Color
beige
Density
1,31 g/cm3

Main Features

  • good heat deflection temperature
  • good machinability
  • inherent flame retardant
  • resistance against high energy radiation
  • good slide and wear properties
  • very good chemical resistance
  • high creep resistance
  • hydrolysis and superheated steam resistant

Target industries

Downloads

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Compression strength 43 MPa 1% / 2% EN ISO 604
    Modulus of elasticity
    (flexural test)
    4200 MPa 2mm/min, 10 N DIN EN ISO 178
    Flexural strength 175 MPa 2mm/min, 10 N DIN EN ISO 178
    Elongation at break (tensile test) 15 % 50mm/min DIN EN ISO 527-2
    Tensile strength at yield 116 MPa 50mm/min DIN EN ISO 527-2
    Elongation at yield 5 % 50mm/min DIN EN ISO 527-2
    Modulus of elasticity
    (tensile test)
    4200 MPa 1mm/min DIN EN ISO 527-2
    Tensile strength 116 MPa 50mm/min DIN EN ISO 527-2
    Notched impact strength (Charpy) 4 kJ/m2 max. 7,5J DIN EN ISO 179-1eA
    Ball indentation hardness 253 MPa ISO 2039-1
    Impact strength (Charpy) n.b. kJ/m2 max. 7,5J DIN EN ISO 179-1eU
    Compression modulus 3400 MPa 5mm/min, 10 N EN ISO 604
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Thermal expansion (CLTE) 5 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 5 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Service temperature 260 C long term NN
    Heat distortion temperature 162 C HDT, Method A ISO-R 75 Method A
    Service temperature 300 C short term NN
    Melting temperature 341 C DIN EN ISO 11357
    Glass transition temperature 150 C DIN EN ISO 11357
    Thermal conductivity 0.27 W/(k*m) ISO 22007-4:2008
    Specific heat 1.1 J/(g*K) ISO 22007-4:2008
    Thermal expansion (CLTE) 7 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1015 O Silver electrode, 23°C, 12% r.h. DIN IEC 60093
    volume resistivity 1015 O*cm Silver electrode, 23°C, 12% r.h. DIN IEC 60093
    Dielectric strength 73 kV/mm 23°C, 50% r.h. ISO 60243-1
    Resistance to tracking (CTI) 125 V Platin electrode, 23°C, 50% r.h., solvent A DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - listed (value at 1.5mm) DIN IEC 60695-11-10;
    Resistance to weathering - - -
    Water absorption % saturation (23°C) DIN EN ISO 62
    Water absorption 0.03 % 24h / 96h (23°C) DIN EN ISO 62
    HZ Semicon brochure yes - -

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