Thermally conducting compounds. More than just one option: TECACOMP TC 

Plastics have always been considered more as insulators, while metals are seen as better conductors of heat. However, in applications involving natural convection, thermally conducting plastics have been proven to offer cooling performance comparable to that of metals. This makes them a true alternative or an ideal way of supplementing conventional solutions.

Thermally conductive plastics from Ensinger come into their own in applications where metals have distinct drawbacks. Their free formability allows heat sink structures to be configured to provide precisely the required heat distribution. Materials which also provide electrical insulating properties can help to reduce the need for TIMs (thermal interface materials). The results: fewer disruptive heat transfers and even more efficient cooling.

Optimum heat dissipation

The thermal conductivity of a component made of TECACOMP TC is between 1 and 25 W/(m·K) depending on the filler used. This makes the TECACOMP TC recipes ideally suited for applications such as heat dissipation in electronic compon­ents.

Formability and functionality

Thermally conductive plastics from Ensinger Compounds can be freely formed by injec­tion moulding. As a result, they open up com­pletely new possibilities in terms of product development and product design. Another advantage over using metal is the facility to equip TECACOMP TC plastics with electrically isol­ating properties. In this way, a single plastic component can be used to cool several different electronic components. Insert moulding of assemblies allows several functions to be performed in one: Mechanical fixture, protection against environmental influences, electrical isolation, heat dissipation.

Added fillers determine the properties

A wide selection of base polymers such as PA, PBT, PP, PPS, and PEEK can be adjusted for heat conduction using specific fillers. The filler also lends the material electrically isolating or electrically conductive properties.

In order to affect the characteristics of the base polymer as little as possible, we only use fillers which require a relatively low filling ratio for these fields of application.


  • Wide range of base polymers: PA, PBT, PPS
  • Wide range of fillers with thermally conductive properties: graphite, carbon fiber, ceramics

Excellent thermal conduction capacity:

up to 10 W/(m·K) with electrically isolating materials and

up to 25 W/(m·K) with electrically conductive materials

  • Extremely good processing properties.
  • Savings potential due to injection moulding capability.