PEEK for Semicon applications

TECAPEEK SE is a Victrex® PEEK polymer modified for Semiconductor industry applications. Due to its low ionic impurities, this material is well suited to applications where high purity is of great concern, such as are found in semiconductor or CMP applications. High dimensional stability and excellent chemical, abrasion and wear resistance, make it an excellent choice for parts with tight tolerances or that require long wear life in harsh environments.


Chemical designation
PEEK (Polyetheretherketone)
1,31 g/cm3

Main Features

  • good heat deflection temperature
  • good machinability
  • inherent flame retardant
  • resistance against high energy radiation
  • good slide and wear properties
  • very good chemical resistance
  • high creep resistance
  • hydrolysis and superheated steam resistant

Target industries

Technical details

  • Mechanical properties
    Mechanical propertiesValueUnitParameterNorm
    Compression strength43MPa1% / 2%EN ISO 604
    Modulus of elasticity
    (flexural test)
    4200MPa2mm/min, 10 NDIN EN ISO 178
    Flexural strength175MPa2mm/min, 10 NDIN EN ISO 178
    Elongation at break (tensile test)15%50mm/minDIN EN ISO 527-2
    Tensile strength at yield116MPa50mm/minDIN EN ISO 527-2
    Elongation at yield5%50mm/minDIN EN ISO 527-2
    Modulus of elasticity
    (tensile test)
    4200MPa1mm/minDIN EN ISO 527-2
    Tensile strength116MPa50mm/minDIN EN ISO 527-2
    Notched impact strength (Charpy)4kJ/m2max. 7,5JDIN EN ISO 179-1eA
    Ball indentation hardness253MPaISO 2039-1
    Impact strength (Charpy)n.b.kJ/m2max. 7,5JDIN EN ISO 179-1eU
    Compression modulus3400MPa5mm/min, 10 NEN ISO 604
  • Thermal properties
    Thermal propertiesValueUnitParameterNorm
    Thermal expansion (CLTE)510-5*1/K23-100°C, long.DIN EN ISO 11359-1;2
    Thermal expansion (CLTE)510-5*1/K23-60°C, long.DIN EN ISO 11359-1;2
    Service temperature260Clong termNN
    Heat distortion temperature162CHDT, Method AISO-R 75 Method A
    Service temperature300Cshort termNN
    Melting temperature341CDIN EN ISO 11357
    Glass transition temperature150CDIN EN ISO 11357
    Thermal conductivity0.27W/(k*m)ISO 22007-4:2008
    Specific heat1.1J/(g*K)ISO 22007-4:2008
    Thermal expansion (CLTE)710-5*1/K100-150°C, long.DIN EN ISO 11359-1;2
  • Electrical properties
    Electrical propertiesValueUnitParameterNorm
    surface resistivity1015OSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    volume resistivity1015O*cmSilver electrode, 23°C, 12% r.h.DIN IEC 60093
    Dielectric strength73kV/mm23°C, 50% r.h.ISO 60243-1
    Resistance to tracking (CTI)125VPlatin electrode, 23°C, 50% r.h., solvent ADIN EN 60112
  • Other properties
    Other propertiesValueUnitParameterNorm
    Resistance to hot water/ bases+--
    Flammability (UL94)V0-listed (value at 1.5mm)DIN IEC 60695-11-10;
    Resistance to weathering---
    Water absorption0.03%24h / 96h (23°C)DIN EN ISO 62

Stock program