TECATRON SE natural

PPS modified for semiconductor industry

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This polyphenylensulfide (PPS) is a high performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties, and is manufactured by Ensinger under the tradename TECATRON SE. Its low ionic impurities make it an excellent choice for applications where high purity is a concern such as Semiconductor CMP (Chemical Mechanical Planarization) applications. Very high creep resistance, and low abrasion characteristics round out the profile of this PPS modification, allowing long term property retention.

Facts

Chemical designation
PPS (Polyphenylensulfide)
Colour
beige
Density
1.36 g/cm3

Main Features

  • good heat deflection temperature
  • good chemical resistance
  • resistance against high energy radiation
  • high strength
  • high dimensional stability
  • high stiffness
  • high creep resistance

Target industries

semiconductor technology

Downloads

Datasheet (PDF)
Product handling (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Modulus of elasticity
    (tensile test)    		 4100 MPa 1mm/min DIN EN ISO 527-2
    Compression modulus 3300 MPa 5mm/min, 10 N EN ISO 604
    Impact strength (Charpy) 29 kJ/m2 max. 7,5J DIN EN ISO 179-1eU
    Elongation at yield (tensile test) 4 % 50mm/min DIN EN ISO 527-2
    Tensile strength at yield 100 MPa 50mm/min DIN EN ISO 527-2
    Tensile strength 102 MPa 50mm/min DIN EN ISO 527-2
    Flexural strength 151 MPa 2mm/min, 10 N DIN EN ISO 178
    Elongation at break (tensile test) 4 % 50mm/min DIN EN ISO 527-2
    Modulus of elasticity
    (flexural test)    		 4000 MPa 2mm/min, 10 N DIN EN ISO 178
    Ball indentation hardness 248 MPa ISO 2039-1
    Compression strength 20/38/96 MPa 1% / 2% / 5% EN ISO 604
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 97 C DIN EN ISO 11357
    Melting temperature 281 C DIN EN ISO 11357
    Thermal conductivity 0.25 W/(k*m) ISO 22007-4:2008
    Specific heat 1.0 J/(g*K) ISO 22007-4:2008
    Thermal expansion (CLTE) 6 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Service temperature 260 C short term NN
    Thermal expansion (CLTE) 7 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Service temperature 230 C long term -
    Thermal expansion (CLTE) 12 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    volume resistivity 1014 O*cm DIN IEC 60093
    surface resistivity 1014 O DIN IEC 60093
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Resistance to weathering - - -
    Water absorption 0.01 % 24h / 96h (23°C) DIN EN ISO 62

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