TECATRON SE natural

PPS modified for semiconductor industry

This polyphenylensulfide (PPS) is a high performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties, and is manufactured by Ensinger under the tradename TECATRON SE. Its low ionic impurities make it an excellent choice for applications where high purity is a concern such as Semiconductor CMP (Chemical Mechanical Planarization) applications. Very high creep resistance, and low abrasion characteristics round out the profile of this PPS modification, allowing long term property retention.

Facts

Chemical designation

PPS (Polyphenylensulfide)

Colour

beige

Density

1,36 g/cm3

Main Features

good heat deflection temperature
good chemical resistance
resistance against high energy radiation
high strength
high dimensional stability
high stiffness
high creep resistance

Target industries

semiconductor technology

Downloads

Datasheet (PDF)

Product handling (PDF)

Technical details

Mechanical properties

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Mechanical properties	Value	Unit	Parameter	Norm
Modulus of elasticity (tensile test)	4100	MPa	1mm/min	DIN EN ISO 527-2
Compression modulus	3300	MPa	5mm/min, 10 N	EN ISO 604
Impact strength (Charpy)	29	kJ/m2	max. 7,5J	DIN EN ISO 179-1eU
Compression strength	20/38/96	MPa	1% / 2% / 5%	EN ISO 604
Elongation at yield (tensile test)	4	%	50mm/min	DIN EN ISO 527-2
Tensile strength at yield	100	MPa	50mm/min	DIN EN ISO 527-2
Tensile strength	102	MPa	50mm/min	DIN EN ISO 527-2
Flexural strength	151	MPa	2mm/min, 10 N	DIN EN ISO 178
Elongation at break (tensile test)	4	%	50mm/min	DIN EN ISO 527-2
Modulus of elasticity (flexural test)	4000	MPa	2mm/min, 10 N	DIN EN ISO 178
Ball indentation hardness	248	MPa		ISO 2039-1

Thermal properties

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Thermal properties	Value	Unit	Parameter	Norm
Thermal expansion (CLTE)	7	10-5*1/K	23-100°C, long.	DIN EN ISO 11359-1;2
Service temperature	230	C	long term	-
Glass transition temperature	97	C		DIN EN ISO 11357
Thermal expansion (CLTE)	6	10-5*1/K	23-60°C, long.	DIN EN ISO 11359-1;2
Service temperature	260	C	short term	NN
Melting temperature	281	C		DIN EN ISO 11357
Thermal conductivity	0.25	W/(k*m)		ISO 22007-4:2008
Specific heat	1.0	J/(g*K)		ISO 22007-4:2008
Thermal expansion (CLTE)	12	10-5*1/K	100-150°C, long.	DIN EN ISO 11359-1;2

Electrical properties

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Electrical properties	Value	Unit	Parameter	Norm
volume resistivity	10¹⁴	O*cm		DIN IEC 60093
surface resistivity	10¹⁴	O		DIN IEC 60093

Other properties

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Other properties	Value	Unit	Parameter	Norm
Water absorption	0.01	%	24h / 96h (23°C)	DIN EN ISO 62
Resistance to hot water/ bases	+	-		-
Flammability (UL94)	V0	-	corresponding to	DIN IEC 60695-11-10;
Resistance to weathering	-	-		-