Compounds product portfolio meets demanding requirements 

Ensinger Compounds develops and manufactures high-performance compounds which are optimised with the aid of fillers and additives. In addition to proven standard materials, we also create individual solutions: compounds tailor-made to meet customer needs.


Friction-wear optimised TECACOMP® TRM

Tribologically optimised and mechanically reinforced compounds with optimum sliding and wear properties at maximal strength.

Thermally conductive TECACOMP® TC

Thermally conductive plastics offer cooling performance comparable to that of metals.

Laser direct structuring TECACOMP® LDS

Injection-moulded high-temperature plastics combine housing and circuit carriers in one.

Highly graphite filled TECACOMP® HTE

For applications in energy technology the high filling ratio of TECACOMP® enables a degree of electrical and thermal conductivity previously unachievable with plastics.

Shielding TECACOMP® EMI

With suitable fillers in Ensinger Plastics compounds, a new housing material smoothes resonances, thus preventing gaps in shielding attenuation.

Detectable TECACOMP® ID

TECACOMP® ID is picked up by metal and X-ray detectors: material residues are detected by standard systems.